Datenblatt-Suchmaschine für elektronische Bauteile |
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LDUV3333 Datenblatt(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LDUV3333 Datenblatt(HTML) 6 Page - LIGITEK electronics co., ltd. |
6 / 6 page Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Solderability Test Thermal Shock Test 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs High Temperature High Humidity Test MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 This test intended to see soldering well performed or not. MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-202:103B JIS C 7021: B-11 JIS C 7021: B-12 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Test Condition High Temperature Storage Test Operating Life Test Test Item Reliability Test: The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:1008 JIS C 7021: B-10 This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. Description MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 Reference Standard LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only Page 5/5 PART NO. LDUV3333 |
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