Datenblatt-Suchmaschine für elektronische Bauteile |
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CB3011220ML Datenblatt(PDF) 1 Page - ABC Taiwan Electronics Corp |
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CB3011220ML Datenblatt(HTML) 1 Page - ABC Taiwan Electronics Corp |
1 / 6 page REF : 20070123-A PAGE: 1 PROD. NAME ABC'S DWG NO. ABC'S ITEM NO. SMD POWER INDUCTOR Ⅰ﹒CONFIGURATION & DIMENSIONS: Ⅱ﹒SCHEMATIC DIAGRAM: Ⅲ﹒MATERIALS: Ⅳ﹒GENERAL SPECIFICATION: a﹒Core:Ferrite core b﹒Wire:Enamelled copper wire c﹒Operating temp.:-40℃----+125℃ b﹒Storage temp.:-40℃ ----+120℃ a﹒Temp. rise :40℃ typ. d﹒Resistance to solder heat:260℃.10 secs. A : 3.60±0.15 m / m B : 3.90 max. C : 1.10±0.10 E : 0.80±0.20 F : 1.60 ref. G : 4.00 ref. D : 1.10±0.30 c﹒Base:Cu/Ag(1.0um) m / m m / m m / m m / m m / m m / m a b c d AR-001A 150 Time ( seconds ) R eflow Area +2.0 ~ 4.0℃ 100 50 0 200 250 150 100 50 Max time above 230℃ :50sec max. Max time above 200℃ :70sec max. +4.0 / sec max. ℃ Temperature R ising Area Preheat Area 150 ~ 200 / 60 ~ 120sec ℃ Peak Temperature: 200 250 260℃ 70sec max. 50sec max. 230℃ -(1.0 ~ 5.0) / sec max. ℃ Forced Cooling Area Peak Temp:260℃ max. d﹒Adhesive:Epoxy resin (included Temp. rise) 4R7 A E H : 1.00 ref. m / m m / m CB3011□□□□L□-□□□ SPECIFICATION FOR APPROVAL requirements e﹒Remark:Products comply with RoHS' (PCB Pattern Suggestion) G H |
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