Datenblatt-Suchmaschine für elektronische Bauteile |
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SB1030220ML Datenblatt(PDF) 1 Page - ABC Taiwan Electronics Corp |
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SB1030220ML Datenblatt(HTML) 1 Page - ABC Taiwan Electronics Corp |
1 / 7 page 260℃ Peak Temperature: Forced Cooling Area -(1.0 ~ 5.0) / sec max. ℃ b d a SB1030□□□□L□-□□□ Ⅲ﹒ MATERIALS: f﹒Remark:Products comply with RoHS' a﹒Temp. rise 30℃ max. e﹒Adhesive:Epoxy resin d﹒Base:LCP Base d﹒Resistance to solder heat:260℃. 10 secs. c﹒Operating temp.:-40℃ ~ +125℃ Ⅳ﹒ GENERAL SPECIFICATION: b﹒Storage temp.:-40℃ ~ +125℃ c﹒Terminal:Cu / Ni / Sn b﹒Wire:Enameled copper wire (class F) a﹒Core:Ferrite DR core AE-001A 50 250 150 200 100 Max time above 200℃ :70sec max. Max time above 230℃ :50sec max. Peak Temp:260℃ max. requirements ( Temp. rise included) 100 0 50 150 Time ( seconds ) 200 70sec max. 50sec max. 150 ~ 200 / 60 ~ 120sec ℃ Preheat Area +4.0 / sec max. ℃ Temperature Rising Area c Reflow Area / sec max. +2.0 ~ 4.0℃ Ⅱ﹒ SCHEMATIC DIAGRAM: Ⅰ﹒ CONFIGURATION & DIMENSIONS: NAME PROD. REF : ( PCB Pattern) G D : 5.6 ref. J 2.4 ref. 10.4 ref. 2.8 ref. I : H G : : ABC'S ITEM NO. ABC'S DWG NO. SPECIFICATION FOR APPROVAL 330 A SMD POWER INDUCTOR : C 3.0±0.3 6.0 typ 2.4 typ. 2.0 typ. : E F : D : 10.0±0.3 10.0±0.3 10.0±0.3 : A B : 250 230℃ m/m m/m m/m m/m m/m m/m m/m m/m m/m m/m PAGE: 1 |
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