Datenblatt-Suchmaschine für elektronische Bauteile |
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74ABT821DB Datenblatt(PDF) 10 Page - NXP Semiconductors |
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74ABT821DB Datenblatt(HTML) 10 Page - NXP Semiconductors |
10 / 16 page 74ABT821_3 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 03 — 25 February 2010 10 of 16 NXP Semiconductors 74ABT821 10-bit D-type flip-flop; positive-edge trigger; 3-state 12. Package outline Fig 9. Package outline SOT137-1 (SO24) UNIT A max. A1 A2 A3 bp cD (1) E (1) (1) eHE LLp Q Z y w v θ REFERENCES OUTLINE VERSION EUROPEAN PROJECTION ISSUE DATE IEC JEDEC JEITA mm inches 2.65 0.3 0.1 2.45 2.25 0.49 0.36 0.32 0.23 15.6 15.2 7.6 7.4 1.27 10.65 10.00 1.1 1.0 0.9 0.4 8 0 o o 0.25 0.1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. 1.1 0.4 SOT137-1 X 12 24 w M θ A A1 A2 b p D HE L p Q detail X E Z c L v M A 13 (A ) 3 A y 0.25 075E05 MS-013 pin 1 index 0.1 0.012 0.004 0.096 0.089 0.019 0.014 0.013 0.009 0.61 0.60 0.30 0.29 0.05 1.4 0.055 0.419 0.394 0.043 0.039 0.035 0.016 0.01 0.25 0.01 0.004 0.043 0.016 0.01 e 1 0 5 10 mm scale SO24: plastic small outline package; 24 leads; body width 7.5 mm SOT137-1 99-12-27 03-02-19 |
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