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REV. B

○BLOCK DIAGRAM

○Pin Number, Pin Name

Pin

Number

Pin

Name

Function

1

CLK

Clock Input from

Microcontroller

2

INH

WDT ON/OFF Function Pin

3

Vcc

Power Supply Pin

4

GND

GND

5

VOUT

Voltage Output Pin

6

RESET

Reset Output Pin

7

CT

External Capacitance for Reset

Output Delay Time, WDT Monitor

Time Setting Connection Pin

FIN

GND

GND

○Pin Settings / Precautions

1. Vcc pin

Insert a 0.33μF～1000μF capacitor between the Vcc and GND pins.The appropriate capacitance value varies by application. Be sure to

allow a sufficient margin for input voltage levels.

2. Output pins

It is necessary to place capacitors between each output pin and GND to prevent oscillation on the output. Usable capacitance values range

from 0.1μF～1000μF. Abrupt fluctuations in input voltage and load conditions may affect the output voltage. Output capacitance values

should be determined only through sufficient testing of the actual application.

○Operation Notes

1. Absolute maximum ratings

Use of the IC in excess of absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the

IC. Assumptions should not be made regarding the state of the IC (e.g., short mode or open mode) when such damage is suffered. If

operational values are expected to exceed the maximum ratings for the device, consider adding protective circuitry (such as fuses) to

eliminate the risk of damaging the IC.

2. Electrical characteristics described in these specifications may vary, depending on temperature, supply voltage, external circuits and

other conditions. Therefore, be sure to check all relevant factors, including transient characteristics.

3. GND potential

The potential of the GND pin must be the minimum potential in the system in all operating conditions. Ensure that no pins are at a voltage

below the GND at any time, regardless of transient characteristics.

4. Ground wiring pattern

When using both small-signal and large-current GND traces, the two ground traces should be routed separately but connected to a single

ground potential within the application in order to avoid variations in the small-signal ground caused by large currents. Also ensure that the

GND traces of external components do not cause variations on GND voltage. The power supply and ground lines must be as short and thick

as possible to reduce line impedance.

5. Inter-pin shorts and mounting errors

Use caution when orienting and positioning the IC for mounting on printed circuit boards. Improper mounting may result in damage to the IC.

Shorts between output pins or between output pins and the power supply or GND pins (caused by poor soldering or foreign objects) may

result in damage to the IC.

6. Operation in strong electromagnetic fields

Using this product in strong electromagnetic fields may cause IC malfunction. Caution should be exercised in applications where strong

electromagnetic fields may be present.

CLK

edge

WDT

VthH

VthL

INH

Vcc

GND

VOUT

RESET

CT

TSD

VREF

PREREG

Vcc

Vcc

VREF_R

OCP

VREF_R

ON/OFF

Curcuit