Datenblatt-Suchmaschine für elektronische Bauteile |
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SN74AUC2GU04 Datenblatt(PDF) 1 Page - Texas Instruments |
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SN74AUC2GU04 Datenblatt(HTML) 1 Page - Texas Instruments |
1 / 13 page www.ti.com FEATURES 3 2 4 6 1 1A 1Y 2Y GND 3 2 4 6 1 1A 1Y 2Y GND 1Y 2Y GND Seemechanicaldrawingsfordimensions. 1 4 2 3 6 V CC V CC 5 V CC 5 5 DBVPACKAGE (TOP VIEW) DCKPACKAGE (TOP VIEW) YZP PACKAGE (BOTTOMVIEW) 2A 2A 2A 1A DESCRIPTION/ORDERING INFORMATION SN74AUC2GU04 DUAL INVERTER GATE SCES438C – APRIL 2003 – REVISED JANUARY 2007 • Available in the Texas Instruments • Low Power Consumption, 10 µA at 1.8 V NanoFree™ Package • ±8-mA Output Drive at 1.8 V • Optimized for 1.8-V Operation and Is 3.6-V I/O • Latch-Up Performance Exceeds 100 mA Per Tolerant to Support Mixed-Mode Signal JESD 78, Class II Operation • ESD Protection Exceeds JESD 22 • Sub-1-V Operable – 2000-V Human-Body Model (A114-A) • Unbuffered Outputs – 200-V Machine Model (A115-A) • Max t pd of 1.9 ns at 1.8 V – 1000-V Charged-Device Model (C101) This dual inverter is operational at 0.8-V to 2.7-V VCC, but is designed specifically for 1.65-V to 1.95-V VCC operation. The SN74AUC2GU04 contains two inverters with unbuffered outputs and performs the Boolean function Y = A. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. For more information about AUC Little Logic devices, please refer to the TI application report, Applications of Texas Instruments AUC Sub-1-V Little Logic Devices, literature number SCEA027. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) 0.23-mm Large Bump – YZP Reel of 3000 SN74AUC2GU04YZPR _ _ _UD_ (Pb-free) –40 °C to 85°C SOT (SOT-23) – DBV Reel of 3000 SN74AUC2GU04DBVR UU4_ SOT (SC-70) – DCK Reel of 3000 SN74AUC2GU04DCKR UD_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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