www.ti.com

A

Y

2

4

Absolute Maximum Ratings

(1)

SN74AUC1G14

SINGLE SCHMITT-TRIGGER INVERTER

SCES375O – SEPTEMBER 2001 – REVISED AUGUST 2007

ORDERING INFORMATION

ORDERABLE PART

TOP-SIDE

NUMBER

NanoFree™ – WCSP (DSBGA)

0.23-mm Large Bump – YZP

Reel of 3000

SN74AUC1G14YZPR

_ _ _UF_

(Pb-free)

–40

°C to 85°C

SON – DRY

Reel of 5000

SN74AUC1G14DRYR

PREVIEW

SOT (SOT-23) – DBV

Reel of 3000

SN74AUC1G14DBVR

U14_

SOT (SC-70) – DCK

Reel of 3000

SN74AUC1G14DCKR

UF_

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the

TI website at www.ti.com.

(3)

DBV/DCK/DRY: The actual top-side marking has one additional character that designates the assembly/test site.

YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,

• = Pb-free).

FUNCTION TABLE

INPUT

OUTPUT

A

Y

H

L

L

H

LOGIC DIAGRAM (POSITIVE LOGIC)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage range

–0.5

3.6

V

–0.5

3.6

V

–0.5

3.6

V

–0.5

V

Input clamp current

–50

mA

Output clamp current

–50

mA

Continuous output current

±20

mA

±100

mA

DBV package

206

DCK package

252

°C/W

DRY package

234

YZP package

132

Storage temperature range

–65

150

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.

(3)

The package thermal impedance is calculated in accordance with JESD 51-7.

2

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