Datenblatt-Suchmaschine für elektronische Bauteile |
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74LVC1G3157DRYRG4 Datenblatt(PDF) 1 Page - Texas Instruments |
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74LVC1G3157DRYRG4 Datenblatt(HTML) 1 Page - Texas Instruments |
1 / 23 page www.ti.com FEATURES See mechanical drawings for dimensions. DBV PACKAGE (TOP VIEW) 2 GND V CC 5 3 4 B1 A 6 1 B2 S DCK PACKAGE (TOP VIEW) 3 4 B1 2 GND A 5 1 B2 V CC 6 S DRL PACKAGE (TOP VIEW) 2 GND V CC 5 1 B2 3 4 B1 A 6 S YZP PACKAGE (BOTTOM VIEW) 2 GND V CC 1 5 B2 B1 4 3 A 6 S DRY PACKAGE (TOP VIEW) GND V CC B2 6 5 4 2 3 B1 A S 1 DESCRIPTION/ORDERING INFORMATION SN74LVC1G3157 SINGLE-POLE, DOUBLE-THROW ANALOG SWITCH SCES424F – JANUARY 2003 – REVISED FEBRUARY 2007 • Low On-State Resistance, Typically ≈6 Ω (VCC = 4.5 V) • 1.65-V to 5.5-V V CC Operation • Latch-Up Performance Exceeds 100 mA Per • Useful for Both Analog and Digital JESD 78, Class II Applications • ESD Protection Exceeds JESD 22 • Specified Break-Before-Make Switching – 2000-V Human-Body Model (A114-A) • Rail-to-Rail Signal Handling – 200-V Machine Model (A115-A) • High Degree of Linearity – 1000-V Charged-Device Model (C101) • High Speed, Typically 0.5 ns (VCC = 3 V, CL = 50 pF) This single-pole, double-throw (SPDT) analog switch is designed for 1.65-V to 5.5-V VCC operation. The SN74LVC1G3157 can handle both analog and digital signals. The device permits signals with amplitudes of up to VCC (peak) to be transmitted in either direction. Applications include signal gating, chopping, modulation or demodulation (modem), and signal multiplexing for analog-to-digital and digital-to-analog conversion systems. ORDERING INFORMATION TA PACKAGE(1) ORDERABLE PART NUMBER TOP-SIDE MARKING(2) NanoFree™ – WCSP (DSBGA) Reel of 3000 SN74LVC1G3157YZPR _ _ _ C5_ 0.23-mm Large Bump – YZP (Pb-free) SON – DRY Reel of 5000 SN74LVC1G3157DRYR C5_ –40 °C to 85°C SOT (SOT-23) – DBV Reel of 3000 SN74LVC1G3157DBVR CC5_ SOT (SC-70) – DCK Reel of 3000 SN74LVC1G3157DCKR C5_ SOT (SOT-553) – DRL Reel of 4000 SN74LVC1G3157DRLR C5_ (1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. (2) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free). Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2003–2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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