Datenblatt-Suchmaschine für elektronische Bauteile |
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CSD17301Q5A Datenblatt(PDF) 2 Page - Texas Instruments |
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CSD17301Q5A Datenblatt(HTML) 2 Page - Texas Instruments |
2 / 11 page CSD17301Q5A SLPS215B – JANUARY 2010 – REVISED JULY 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Static Characteristics BVDSS Drain to Source Voltage VGS = 0V, ID = 250mA 30 V IDSS Drain to Source Leakage Current VGS = 0V, VDS = 24V 1 mA IGSS Gate to Source Leakage Current VDS = 0V, VGS = +10 / –8V 100 nA VGS(th) Gate to Source Threshold Voltage VDS = VGS, ID = 250mA 0.9 1.1 1.55 V VGS = 3V, ID = 25A 2.9 3.7 m Ω RDS(on) Drain to Source On Resistance VGS = 4.5V, ID = 25A 2.3 3 m Ω VGS = 8V, ID = 25A 2 2.6 m Ω gfs Transconductance VDS = 15V, ID = 25A 149 S Dynamic Characteristics Ciss Input Capacitance 2660 3480 pF Coss Output Capacitance VGS = 0V, VDS = 15V, f = 1MHz 1420 1850 pF Crss Reverse Transfer Capacitance 80 105 pF RG Series Gate Resistance 1.3 2.6 Ω Qg Gate Charge Total (4.5V) 19 25 nC Qgd Gate Charge Gate to Drain 4.3 nC VDS = 15V, ID = 25A Qgs Gate Charge Gate to Source 5.7 nC Qg(th) Gate Charge at Vth 2.9 nC Qoss Output Charge VDS = 14V, VGS = 0V 35 nC td(on) Turn On Delay Time 10.7 ns tr Rise Time 16.2 ns VDS = 15V, VGS = 4.5V, ID = 25A, RG = 2Ω td(off) Turn Off Delay Time 28 ns tf Fall Time 10.5 ns Diode Characteristics VSD Diode Forward Voltage ISD = 25A, VGS = 0V 0.8 1 V Qrr Reverse Recovery Charge 50 nC VDD= 14V, IF = 25A, di/dt = 300A/ms trr Reverse Recovery Time 33 ns THERMAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER MIN TYP MAX UNIT RqJC Thermal Resistance Junction to Case(1) 2.2 °C/W RqJA Thermal Resistance Junction to Ambient(1)(2) 49 °C/W (1) RqJC is determined with the device mounted on a 1-inch 2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm × 3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RqJC is specified by design, whereas RqJA is determined by the user’s board design. (2) Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu. 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CSD17301Q5A |
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