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SN74AUP1G04DCKRE4 Datenblatt(PDF) 2 Page - Texas Instruments

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Teilenummer SN74AUP1G04DCKRE4
Bauteilbeschribung  LOW-POWER SINGLE INVERTER GATE
Download  21 Pages
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Hersteller  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

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AUP
LVC
AUP
AUP
LVC
Static-PowerConsumption
( A)
m
Dynamic-PowerConsumption
(pF)
Single,dual,andtriplegates.
3.3-V
Logic
3.3-V
Logic
0%
20%
40%
60%
80%
100%
0%
20%
40%
60%
80%
100%
-0.5
0
0.5
1
1.5
2
2.5
3
3.5
0
5
10
15
20
25
30
35
40
45
Time(ns)
AUP1G04dataatC =15pF.
L
Output
Input
SwitchingCharacteristics
at25MHz
SN74AUP1G04
SCES571H – JUNE 2004 – REVISED MARCH 2010
www.ti.com
Figure 1. AUP – The Lowest-Power Family
Figure 2. Excellent Signal Integrity
This single inverter gate performs the Boolean function Y = A.
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
ORDERABLE PART
TOP-SIDE
TA
PACKAGE(2)
NUMBER
MARKING(3)
NanoStar™ – WCSP (DSBGA)
Reel of 3000
SN74AUP1G04YFPR
_ _ _ H C _
0.23-mm large bump – YFP
QFN – DRY
Reel of 5000
SN74AUP1G04DRYR
HC
uQFN – DSF
Reel of 5000
SN74AUP1G04DSFR
HC
–40°C to 85°C
SOT (SOT-23) – DBV
Reel of 3000
SN74AUP1G04DBVR
H04_
SOT (SC-70) – DCK
Reel of 3000
SN74AUP1G04DCKR
HC_
SOT (SOT-553) – DRL
Reel of 4000
SN74AUP1G04DRLR
HC_
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3)
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUT
INPUT
A
B
H
L
L
H
2
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Copyright © 2004–2010, Texas Instruments Incorporated
Product Folder Link(s): SN74AUP1G04


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