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IRF7757GPBF Datenblatt(PDF) 1 Page - International Rectifier

Teilenummer IRF7757GPBF
Bauteilbeschribung  HEXFETPower MOSFET Ultra Low On-Resistance
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Hersteller  IRF [International Rectifier]
Direct Link  http://www.irf.com
Logo IRF - International Rectifier

IRF7757GPBF Datenblatt(HTML) 1 Page - International Rectifier

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Parameter
Max.
Units
VDS
Drain- Source Voltage
20
V
ID @ TA = 25°C
Continuous Drain Current, VGS @ 4.5V
4.8
ID @ TA= 70°C
Continuous Drain Current, VGS @ 4.5V
3.9
A
IDM
Pulsed Drain Current

19
PD @TA = 25°C
Power Dissipation
ƒ
1.2
PD @TA = 70°C
Power Dissipation
ƒ
0.76
Linear Derating Factor
9.5
mW/°C
VGS
Gate-to-Source Voltage
± 12
V
TJ, TSTG
Junction and Storage Temperature Range
-55 to + 150
°C
05/14/09
Parameter
Max.
Units
RθJA
Maximum Junction-to-Ambient
ƒ
105
°C/W
Thermal Resistance
Absolute Maximum Ratings
W
www.irf.com
1
IRF7757GPbF
HEXFET® Power MOSFET
VDSS
RDS(on) max (mW)
ID
20V
35@VGS = 4.5V
4.8A
40@VGS = 2.5V
3.8A
TSSOP-8
Description
l Ultra Low On-Resistance
l Dual N-Channel MOSFET
l Very Small SOIC Package
l Low Profile (< 1.2mm)
l Available in Tape & Reel
l Common Drain Configuration
l Lead-Free
l Halogen-Free
HEXFET® Power MOSFETs from International Rectifier
utilize advanced processing techniques to achieve ex-
tremely low on-resistance per silicon area. This benefit,
combined with the ruggedized device design, that Inter-
national Rectifier is well known for,
provides the de-
signer with an extremely efficient and reliable device
for battery and load management.
The TSSOP-8 package has 45% less footprint area than
the standard SO-8. This makes the TSSOP-8 an ideal
device for applications where printed circuit board space
is at a premium. The low profile (<1.2mm) allows it to fit
easily into extremely thin environments such as portable
electronics and PCMCIA cards.
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