IRF6674TRPbF

www.irf.com

3

Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Case



Notes:

back and with small clip heatsink.

ƒ Surface mounted on 1 in. square Cu

board (still air).

‰ Mounted on minimum footprint full size board with metalized

back and with small clip heatsink. (still air)

1E-006

1E-005

0.0001

0.001

0.01

0.1

t1 , Rectangular Pulse Duration (sec)

0.001

0.01

0.1

1

10

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = Pdm x Zthjc + Tc

Ri (°C/W)

τι (sec)

0.023002 0.000008

0.269754 0.000072

0.770575 0.001409

0.337715 0.005778

Ci

i

/Ri

Ci=

τi/Ri

τ

Absolute Maximum Ratings

Parameter

Units

Power Dissipation

e

W

Power Dissipation

e

Power Dissipation

f

Peak Soldering Temperature

°C

Operating Junction and

Storage Temperature Range

Thermal Resistance

Parameter

Typ.

Max.

Units

Junction-to-Ambient

el

–––

35

Junction-to-Ambient

jl

12.5

–––

Junction-to-Ambient

kl

20

–––

°C/W

Junction-to-Case

fl

–––

1.4

Junction-to-PCB Mounted

1.0

–––

3.6

2.3

270

-40 to + 150

Max.

89