BAP55LX

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Product data sheet

Rev. 2 — 16 December 2010

5 of 9

NXP Semiconductors

BAP55LX

Silicon PIN diode

8.

Package outline

Fig 5.

Package outline SOD882T

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

SOD882T

SOD882T

04-12-14

06-04-12

Note

1. The marking bar indicates the cathode

UNIT

A

mm

0.40

0.36

0.55

0.45

0.65

0.55

1.05

0.95

0.30

0.22

max

DIMENSIONS (mm are the original dimensions)

Leadless ultra small plastic package; 2 terminals; body 1 x 0.6 x 0.4 mm

A

B

y

wB

M

A

b (2

×)

(2

×)

(2

×)

D

E

(1)

0

0.5

1 mm

scale

0.04

b

D

E

0.65

w

0.1

y

0.03

2

1

wA

M