MC68HC05 datasheet(9/298 Pages) MOTOROLA

Teilenummer	MC68HC05

Bauteilbeschribung	High-density Complementary Metal Oxide Semiconductor (HCMOS) Microcomputer Unit

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Hersteller	MOTOROLA [Motorola, Inc]

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9 / 298 page

MC68HC05B6

Rev. 4

MOTOROLA

i

TABLE OF CONTENTS

Paragraph

Number

Page

Number

TITLE

TABLE OF CONTENTS

1

INTRODUCTION

1.1

Features.............................................................................................................1–2

1.2

Mask options for the MC68HC05B6 ..................................................................1–3

2

MODES OF OPERATION AND PIN DESCRIPTIONS

2.1

Modes of operation ............................................................................................2–1

2.1.1

Single chip mode .........................................................................................2–1

2.2

Serial RAM loader .............................................................................................2–2

2.3

‘Jump to any address’........................................................................................2–4

2.4

Low power modes..............................................................................................2–6

2.4.1

STOP ...........................................................................................................2–6

2.4.2

WAIT ............................................................................................................2–8

2.4.2.1

Power consumption during WAIT mode .................................................2–8

2.4.3

SLOW mode.................................................................................................2–9

2.4.3.1

Miscellaneous register...........................................................................2–9

2.5

Pin descriptions ..............................................................................................2–10

2.5.1

VDD and VSS ............................................................................................2–10

2.5.2

IRQ ............................................................................................................2–10

2.5.3

RESET .......................................................................................................2–10

2.5.4

TCAP1 .......................................................................................................2–10

2.5.5

TCAP2 .......................................................................................................2–11

2.5.6

TCMP1.......................................................................................................2–11

2.5.7

TCMP2.......................................................................................................2–11

2.5.8

OSC1, OSC2 .............................................................................................2–11

2.5.8.1

Crystal ..................................................................................................2–11

2.5.8.2

Ceramic resonator................................................................................2–11

2.5.8.3

External clock .......................................................................................2–12

2.5.9

RDI (Receive data in).................................................................................2–13

2.5.10

TDO (Transmit data out) ............................................................................2–13

2.5.11

SCLK..........................................................................................................2–13

2.5.12

PLMA .........................................................................................................2–13

TPG

7

05B6Book Page i Tuesday, April 6, 1999 8:24 am

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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