Datenblatt-Suchmaschine für elektronische Bauteile |
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ISL28108 Datenblatt(PDF) 4 Page - Intersil Corporation |
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ISL28108 Datenblatt(HTML) 4 Page - Intersil Corporation |
4 / 26 page ISL28108, ISL28208, ISL28408 4 FN6935.2 July 1, 2011 Absolute Maximum Ratings Thermal Information Maximum Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42V Maximum Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .42V or V- - 0.5V to V+ + 0.5V Min/Max Input Voltage . . . . . . . . . . . . . . . . . . .42V or V- - 0.5V to V+ + 0.5V Max/Min Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20mA Output Short-Circuit Duration (1 output at a time) . . . . . . . . . . . Indefinite ESD Tolerance Human Body Model (Tested per JESD22-A114F) . . . . . . . . . . . . . . . . 6kV Machine Model (Tested per JESD22-A115-C) . . . . . . . . . . . . . . . . . . 400V Charged Device Model (Tested per JESD22-C110D) . . . . . . . . . . . . . 2kV Thermal Resistance (Typical) θJA (°C/W) θJC (°C/W) 8 Ld SOIC Package (108, 208, Notes 4, 7) . . 120 55 8 Ld TDFN Package (108, 208, Notes 5, 6). . 47 6 8 Ld MSOP Package (108, 208, Notes 4, 7). 150 45 14 Ld SOIC Package (408, Notes 4, 7). . . . . . - - Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp Operating Conditions Ambient Operating Temperature Range. . . . . . . . . . . . . . -40°C to +125°C Maximum Operating Junction Temperature . . . . . . . . . . . . . . . . . . +150°C Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V (±1.5V) to 40V (±20V) CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty. NOTES: 4. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 5. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 6. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. 7. For θJC, the “case temp” location is taken at the package top center. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications V S ±15V, VCM = 0, VO = 0V, RL = Open, TA= +25°C, unless otherwise noted. Boldface limits apply over the operating temperature range, -40°C to +125°C. Temperature data established by characterization. PARAMETER DESCRIPTION CONDITIONS MIN (Note 8) TYP MAX (Note 8) UNIT VOS Input Offset Voltage -230 25 230 µV -330 330 µV TCVOS Input Offset Voltage Temperature Coefficient ISL28208 SOIC -40°C to +125°C 0.1 1.1 µV/ °C ISL28208 TDFN -40°C to +125°C 0.2 1.4 µV/ °C ΔVOS Input Offset Voltage Match (ISL28208 only) -300 5 300 µV -400 400 µV IB Input Bias Current -43 -13 nA -63 nA TCIB Input Bias Current Temperature Coefficient 0.07 nA/ °C IOS Input Offset Current -3 0 3 nA -4 4 nA CMRR Common-Mode Rejection Ratio VCM = V- -0.5V to V+ -1.8V 119 dB VCM = V- -0.2V to V+ -1.8V 123 dB 102 dB VCM = V- to V+ -1.8V 105 123 dB 102 115 dB |
Ähnliche Teilenummer - ISL28108 |
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Ähnliche Beschreibung - ISL28108 |
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