TPD8E003

www.ti.com

SLLSE38A – JUNE 2010 – REVISED AUGUST 2010

8-CHANNEL ESD ARRAY FOR PORTABLE SPACE-SAVING APPLICATIONS

Check for Samples: TPD8E003

1

FEATURES

DQD PACKAGE

•

8-Channel ESD Clamp Array to Enhance

(TOP VIEW)

System-Level ESD Protection

•

Exceeds IEC61000-4-2 (Level 4) ESD

Protection Requirements

–

±12-kV IEC 61000-4-2 Contact Discharge

–

±15-kV IEC 61000-4-2 Air-Gap Discharge

•

3.5-A Peak Pulse Current (8/20-µs Pulse)

•

±15-kV Human-Body Model (HBM)

•

Low Breakdown Voltage of 6 V

DESCRIPTION

•

Low Leakage Current

•

Space-Saving Ultra-Thin, Small Outline

The TPD8E003 is an array of 8 ESD clamps in a

space saving SON (DQD) package. This integrated

No-Lead [WSON (DQD)] Package (0.4-mm

transient voltage suppressor device is designed for

Pitch)

applications requiring system level ESD robustness. It

is intended for use in sensitive equipment such as

APPLICATIONS

portable

computers,

cell

phone,

communication

•

Keypad

systems, and other applications. Its integrated design

•

Touch-Screen Interface

provides very effective and reliable protection for

•

Memory Interface

eight separate lines using only one package. The

monolithic silicon technology of TPD8E003 offers

•

Docking Connector Interface

superior

matching

between

multiple

lines

over

discrete ESD clamp solutions.

The TPD8E003 includes an ESD protection circuitry

which prevents damage to the application when

subjected to ESD stress exceeding IEC 61000-4-2

(Level 4). The TPD8E003 is specified for –40°C to

85°C operation.

ORDERING INFORMATION

ORDERABLE PART NUMBER

TOP-SIDE MARKING

L = 1.7 mm, W = 1.35 mm, H = 0.75

–40°C to 85°C

WSON – DQD

TPD8E003DQDR

65S

mm, pitch = 0.4 mm

(1)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(2)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

CIRCUIT SCHEMATIC

1

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2010, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.