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CDBM1100-G Datenblatt(PDF) 1 Page - Comchip Technology

Teilenummer CDBM1100-G
Bauteilbeschribung  SMD Schottky Barrier Rectifiers
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Hersteller  COMCHIP [Comchip Technology]
Direct Link  http://www.comchiptech.com
Logo COMCHIP - Comchip Technology

CDBM1100-G Datenblatt(HTML) 1 Page - Comchip Technology

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Reverse Voltage: 20 to 150 Volts
Forward Current: 1.0 Amp
RoHS Device
Dimensions in inches and (millimeter)
CDBM120-G Thru. CDBM1150-G
Page 1
QW-BB005
SMD Schottky Barrier Rectifiers
REV:D
Comchip Technology CO., LTD.
Mini SMA/SOD-123
0.154(3.90)
0.138(3.50)
0.012(0.30) Typ.
0.071(1.80)
0.055(1.40)
0.122(2.80)
0.096(2.40)
0.067(1.70)
0.051(1.30)
0.035(0.90) Typ.
0.035(0.90) Typ.
Unit
CDBM
CDBM
160-G
CDBM
180-G
CDBM
1150-G
14
20
30
21
30
60
42
60
30
0.5
10
98
120
80
56
80
150
105
150
130-G
Parameter
Symbol
CDBM
120-G
20
CDBM
1100-G
100
70
100
CDBM
28
40
50
35
50
150-G
CDBM
140-G
40
Repetitive peak reverse voltage
Maximum RMS voltage
Continuous reverse voltage
Maximum forward voltage @IF=1.0A
Forward rectified current
VRRM
VRMS
VR
VF
IO
0.70
0.50
0.85
0.92
1.0
Forward surge current, 8.3ms half sine wave
superimposed on rated load (JEDEC method)
Typ. thermal resistance, junction to ambient air
Typ. diode junction capacitance (Note 1)
Operating junction temperature
Storage temperature
IFSM
IR
RθJA
CJ
TJ
TSTG
Reverse current on VR=VRRM
@TA=25°C
@TA=125°C
Note 1: f=1MHz and applied 4V DC reverse voltage.
-55 to +125
-55 to +150
-65 to +175
V
V
V
V
A
A
mA
pF
O
C
O
C
O
C/W
Maximum Ratings (at TA=25°C unless otherwise noted)
Features
-Batch process design, excellent powe
Mechanical data
Molded plastic, JEDEC Mini SMA/SOD-123.
-Weight:0.027 gram(approx.).
dissipation offers better reverse leakage
current and thermal resistance.
-Low profile surface mounted application
in order to optimize board space.
-Tiny plastic SMD package.
-Low power loss, high efficiency.
-High current capability, low forward voltage dorp.
-High surge capability.
-Guardring for overvoltage protection.
-Ultra high-speed switching.
-Silicon epitaxial planarchip, metal silicon junction.
-Lead-free parts meet environmental
standards of MIL-STD-19500 /228
-Case:
-Terminals: Solde plated, solderable per
MIL-STD-750, method 2026.
-Polarity: Indicated by cathode band.
-Mounting position: Any


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