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ULN2003V12 Datenblatt(PDF) 2 Page - Texas Instruments

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Teilenummer ULN2003V12
Bauteilbeschribung  7-Channel Relay and Inductive Load Sink Driver
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

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ULN2003V12
SLRS060A – MAY 2012 – REVISED JUNE 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
TA
PART NUMBER
PACKAGE
TOP-SIDE MARKING
ULN2003V12DR
16-Pin SOIC
Reel of 2500
U2003V12
–40°C to 85°C
ULN2003V12PWR
16-Pin TSSOP
Reel of 2000
U2003V12
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Specified at TJ = –40°C to 125°C unless otherwise noted.
VALUE
UNIT
MIN
MAX
VIN
Pins IN1- IN7 to GND voltage
–0.3
5.5
V
VOUT
Pins OUT1 – OUT7 to GND voltage
20
V
VCOM
Pin COM to GND voltage
20
V
Max GND-pin continuous current (100ºC < TJ < +125°C)
700
mA
IGND
Max GND-pin continuous current (TJ < +100°C)
1.0
A
16 Pin - SOIC
0.86
W
PD
Total device power dissipation at TA = 85°C
16 Pin - TSSOP
0.68
W
ESD Rating – HBM
2
kV
ESD
ESD Rating – CDM
500
V
TA
Operating free-air ambient temperature range
–40
85
°C
TJ
Operating virtual junction temperature
–55
150
°C
Tstg
Storage temperature range
–55
150
°C
(1)
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for
extended periods may affect device reliability.
DISSIPATION RATINGS
(1) (2)
BOARD
PACKAGE
θJC
θJA
(3)
DERATING
TA < 25°C
TA = 70°C
TA = 85°C
FACTOR ABOVE
TA = 25ºC
High-K
16-Pin SOIC
46°C/W
75°C/W
13.33 mW/ºC
1.66 W
1.06 W
0.86 W
High-K
16-Pin TSSOP
49°C/W
95°C/W
10.44 mW/ºC
1.31 W
0.84 W
0.68 W
(1)
Maximum dissipation values for retaining device junction temperature of 150°C
(2)
Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance
(3)
Operating at the absolute TJ-max of 150°C can affect reliability– for higher reliability it is recommended to ensure TJ < 125°C
RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
MIN
TYP
MAX
UNIT
VOUT
Channel off-state output pull-up voltage
16
V
VCOM
COM pin voltage
16
V
VINx = 3.3V
100(1)
IOUT(ON)
Per channel continuous sink current
mA
VINx = 5.0V
140(1)
TA
Operating ambient temperature
–40
85
ºC
TJ
Operating junction temperature
–40
125
ºC
(1)
1) Refer to ABSOLUTE MAXIMUM RATINGS for TJ dependent absolute maximum GND-pin current
2
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Copyright © 2012, Texas Instruments Incorporated
Product Folder Link(s): ULN2003V12


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