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ULN2003V12 Datenblatt(PDF) 2 Page - Texas Instruments |
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ULN2003V12 Datenblatt(HTML) 2 Page - Texas Instruments |
2 / 18 page ULN2003V12 SLRS060A – MAY 2012 – REVISED JUNE 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. ORDERING INFORMATION(1) TA PART NUMBER PACKAGE TOP-SIDE MARKING ULN2003V12DR 16-Pin SOIC Reel of 2500 U2003V12 –40°C to 85°C ULN2003V12PWR 16-Pin TSSOP Reel of 2000 U2003V12 (1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. ABSOLUTE MAXIMUM RATINGS (1) Specified at TJ = –40°C to 125°C unless otherwise noted. VALUE UNIT MIN MAX VIN Pins IN1- IN7 to GND voltage –0.3 5.5 V VOUT Pins OUT1 – OUT7 to GND voltage 20 V VCOM Pin COM to GND voltage 20 V Max GND-pin continuous current (100ºC < TJ < +125°C) 700 mA IGND Max GND-pin continuous current (TJ < +100°C) 1.0 A 16 Pin - SOIC 0.86 W PD Total device power dissipation at TA = 85°C 16 Pin - TSSOP 0.68 W ESD Rating – HBM 2 kV ESD ESD Rating – CDM 500 V TA Operating free-air ambient temperature range –40 85 °C TJ Operating virtual junction temperature –55 150 °C Tstg Storage temperature range –55 150 °C (1) Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. DISSIPATION RATINGS (1) (2) BOARD PACKAGE θJC θJA (3) DERATING TA < 25°C TA = 70°C TA = 85°C FACTOR ABOVE TA = 25ºC High-K 16-Pin SOIC 46°C/W 75°C/W 13.33 mW/ºC 1.66 W 1.06 W 0.86 W High-K 16-Pin TSSOP 49°C/W 95°C/W 10.44 mW/ºC 1.31 W 0.84 W 0.68 W (1) Maximum dissipation values for retaining device junction temperature of 150°C (2) Refer to TI’s design support web page at www.ti.com/thermal for improving device thermal performance (3) Operating at the absolute TJ-max of 150°C can affect reliability– for higher reliability it is recommended to ensure TJ < 125°C RECOMMENDED OPERATING CONDITIONS over operating free-air temperature range (unless otherwise noted) PARAMETER MIN TYP MAX UNIT VOUT Channel off-state output pull-up voltage 16 V VCOM COM pin voltage 16 V VINx = 3.3V 100(1) IOUT(ON) Per channel continuous sink current mA VINx = 5.0V 140(1) TA Operating ambient temperature –40 85 ºC TJ Operating junction temperature –40 125 ºC (1) 1) Refer to ABSOLUTE MAXIMUM RATINGS for TJ dependent absolute maximum GND-pin current 2 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Product Folder Link(s): ULN2003V12 |
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