Datenblatt-Suchmaschine für elektronische Bauteile |
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DAC714HC Datenblatt(PDF) 2 Page - Texas Instruments |
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DAC714HC Datenblatt(HTML) 2 Page - Texas Instruments |
2 / 22 page DAC714 2 SBAS032A www.ti.com PIN CONFIGURATION Top View CLK A 0 A 1 SDI SDO DCOM +V CC ACOM DAC714 CLR –V CC Gain Adjust Offset Adjust V REF OUT R BPO R FB2 V OUT 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 PIN DESCRIPTIONS PIN LABEL DESCRIPTION 1 CLK Serial Data Clock 2A0 Enable for Input Register (Active Low) 3A1 Enable for D/A Latch (Active Low) 4 SDI Serial Data Input 5 SDO Serial Data Output 6 DCOM Digital Ground 7+VCC Positive Power Supply 8 ACOM Analog Ground 9VOUT D/A Output 10 RFB2 ±10V Range Feedback Output 11 RBPO Bipolar Offset 12 VREF OUT Voltage Reference Output 13 Offset Adjust Offset Adjust 14 Gain Adjust Gain Adjust 15 –VCC Negative Power Supply 16 CLR Clear SO/DIP +VCC to Common .................................................................... 0V to +17V –VCC to Common .................................................................... 0V to –17V +VCC to –VCC ....................................................................................... 34V ACOM to DCOM ............................................................................... ±0.5V Digital Inputs to Common ............................................. –1V to (VCC –0.7V) External Voltage Applied to BPO and Range Resistors .................... ±V CC VREF OUT .......................................................... Indefinite Short to Common VOUT ............................................................... Indefinite Short to Common SDO ............................................................... Indefinite Short to Common Power Dissipation .......................................................................... 750mW Storage Temperature ...................................................... –60 °C to +150°C Lead Temperature (soldering, 10s) ............................................... +300 °C NOTE: (1) Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute maximum conditions for extended periods may affect device reliability. ABSOLUTE MAXIMUM RATINGS(1) ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at www.ti.com. PACKAGE/ORDERING INFORMATION |
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