CD74HC365-Q1, CD74HC366-Q1, CD74HCT365-Q1

www.ti.com

SCHS382 – JANUARY 2010

HIGH-SPEED CMOS LOGIC HEX BUFFER/LINE DRIVER, THREE-STATE NON-INVERTING

AND INVERTING

Check for Samples: CD74HC365-Q1, CD74HC366-Q1, CD74HCT365-Q1

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FEATURES

•

HCT Types

•

Qualified for Automotive Applications

–

4.5V to 5.5V Operation

•

Buffered Inputs

–

Direct LSTTL Input Logic Compatibility,

•

High Current Bus Driver Outputs

–

CMOS Input Compatibility, Il

•

•

Fanout (Over Temperature Range)

D PACKAGE

(TOP VIEW)

–

Standard Outputs . . . . . . . . . . . . . . . 10

LSTTL Loads

–

Bus Driver Outputs . . . . . . . . . . . . . 15

LSTTL Loads

•

Wide Operating Temperature Range . . . –40°C

to 125°C

•

Balanced Propagation Delay and Transition

Times

•

Significant Power Reduction Compared to

LSTTL Logic ICs

•

HC Types

–

2V to 6V Operation

–

DESCRIPTION

The CD74HC365-Q1, CD74HC366-Q1, and CD74HCT365-Q1 silicon gate CMOS three state buffers are general

purpose high-speed non-inverting and inverting buffers. They have high drive current outputs which enable high

speed operation even when driving large bus capacitances. These circuits possess the low power dissipation of

CMOS circuitry, yet have speeds comparable to low power Schottky TTL circuits. Both circuits are capable of

driving up to 15 low power Schottky inputs.

The CD74HC365-Q1 and CD74HCT365-Q1 are non-inverting buffers, whereas the CD74HC366-Q1 is an

inverting buffer. These devices have two three-state control inputs (OE1 and OE2) which are NORed together to

control all six gates.

The ’HCT365-Q1 logic families are speed, function and pin compatible with the standard LS logic family.

ORDERABLE PART NUMBER

TOP-SIDE MARKING

CD74HC366QDRQ1

HC366Q

–40°C to 125°C

SOIC – D

Reel of 2500

CD74HC365QDRQ1

Product Preview

CD74HCT365QDRQ1

Product Preview

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

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Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Copyright © 2010, Texas Instruments Incorporated

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.