Datenblatt-Suchmaschine für elektronische Bauteile |
|
CDCLVD1208 Datenblatt(PDF) 11 Page - Texas Instruments |
|
|
CDCLVD1208 Datenblatt(HTML) 11 Page - Texas Instruments |
11 / 21 page V OS GND 3,0mm(min) 0,33mm(typ) 0,75mm(typ) CDCLVD1208 www.ti.com SCAS899 – AUGUST 2010 TYPICAL CHARACTERISTICS (continued) Figure 11. Output AC Common Mode APPLICATION INFORMATION THERMAL MANAGEMENT For reliability and performance reasons, the die temperature should be limited to a maximum of 125°C. The device package has an exposed pad that provides the primary heat removal path to the printed circuit board (PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a ground plane must be incorporated into the PCB within the footprint of the package. The thermal pad must be soldered down to ensure adequate heat conduction to of the package. Figure 12 shows a recommended land and via pattern. Figure 12. Recommended PCB Layout POWER SUPPLY FILTERING High-performance clock buffers are sensitive to noises on the power supply, which can dramatically increase the additive jitter of the buffer. Thus, it is essential to reduce noise from the system power supply, especially when jitter/phase noise is critical to the application. Filter capacitors are used to eliminate the low-frequency noise from the power supply, where the bypass capacitors provide the low impedance path for high-frequency noise and guard the power-supply system against the induced fluctuations. These bypass capacitors also provide instantaneous current surges as required by the device and should have low equivalent series resistance (ESR). To properly use the bypass capacitors, they must be placed close to the power-supply pins and laid out with short loops to minimize inductance. It is recommended to add as many high-frequency (for example, 0.1 mF) bypass capacitors as there are supply pins in the package. It is recommended, but not required, to insert a ferrite bead between the board power supply and Copyright © 2010, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Link(s): CDCLVD1208 |
Ähnliche Teilenummer - CDCLVD1208 |
|
Ähnliche Beschreibung - CDCLVD1208 |
|
|
Link URL |
Privatsphäre und Datenschutz |
ALLDATASHEETDE.COM |
War ALLDATASHEET hilfreich? [ DONATE ] |
Über Alldatasheet | Werbung | Kontakt | Privatsphäre und Datenschutz | Linktausch | Hersteller All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |