Datenblatt-Suchmaschine für elektronische Bauteile |
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CDCLVD1216 Datenblatt(PDF) 10 Page - Texas Instruments |
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CDCLVD1216 Datenblatt(HTML) 10 Page - Texas Instruments |
10 / 20 page V OS GND FerriteBead 1 µF 10µF 0.1 µF(x6) Board Supply Chip Supply CDCLVD1216 SCAS900B – OCTOBER 2010 – REVISED JANUARY 2011 www.ti.com TYPICAL CHARACTERISTICS (continued) Figure 11. Output AC Common Mode APPLICATION INFORMATION THERMAL MANAGEMENT For reliability and performance reasons, the die temperature should be limited to a maximum of +125°C. The device package has an exposed pad that provides the primary heat removal path to the printed circuit board (PCB). To maximize the heat dissipation from the package, a thermal landing pattern including multiple vias to a ground plane must be incorporated into the PCB within the footprint of the package. The thermal pad must be soldered down to ensure adequate heat conduction to of the package. Check the mechanical data at the end of the data sheet for land and via pattern examples. POWER SUPPLY FILTERING High-performance clock buffers are sensitive to noise on the power supply, which can dramatically increase the additive jitter of the buffer. Thus, it is essential to reduce noise from the system power supply, especially when jitter/phase noise is critical to the application. Filter capacitors are used to eliminate the low-frequency noise from the power supply, where the bypass capacitors provide the low impedance path for high-frequency noise and guard the power-supply system against the induced fluctuations. These bypass capacitors also provide instantaneous current surges as required by the device and should have low equivalent series resistance (ESR). To properly use the bypass capacitors, they must be placed close to the power-supply pins and laid out with short loops to minimize inductance. It is recommended to add as many high-frequency (for example, 0.1 mF) bypass capacitors as there are supply pins in the package. It is recommended, but not required, to insert a ferrite bead between the board power supply and the chip power supply that isolates the high-frequency switching noises generated by the clock driver; these beads prevent the switching noise from leaking into the board supply. Choose an appropriate ferrite bead with low dc resistance because it is imperative to provide adequate isolation between the board supply and the chip supply, as well as to maintain a voltage at the supply pins that is greater than the minimum voltage required for proper operation. Figure 12. Power Supply Filtering 10 Submit Documentation Feedback Copyright © 2010–2011, Texas Instruments Incorporated Product Folder Link(s): CDCLVD1216 |
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