Datenblatt-Suchmaschine für elektronische Bauteile |
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CSD17309Q3 Datenblatt(PDF) 2 Page - Texas Instruments |
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CSD17309Q3 Datenblatt(HTML) 2 Page - Texas Instruments |
2 / 11 page CSD17309Q3 SLPS261A – MARCH 2010 – REVISED OCTOBER 2010 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Static Characteristics BVDSS Drain to Source Voltage VGS = 0V, ID = 250mA 30 V IDSS Drain to Source Leakage Current VGS = 0V, VDS = 24V 1 mA IGSS Gate to Source Leakage Current VDS = 0V, VGS = +10 / –8V 100 nA VGS(th) Gate to Source Threshold Voltage VDS = VGS, ID = 250mA 0.9 1.2 1.7 V VGS = 3.0V, ID = 18A 6.3 8.5 m Ω RDS(on) Drain to Source On Resistance VGS = 4.5V, ID = 18A 4.9 6.3 m Ω VGS = 8V, ID = 18A 4.2 5.4 m Ω gfs Transconductance VDS = 15V, ID = 18A 67 S Dynamic Characteristics CISS Input Capacitance 1150 1440 pF VGS = 0V, VDS = 15V, COSS Output Capacitance 580 750 pF f = 1MHz CRSS Reverse Transfer Capacitance 43 56 pF Rg Series Gate Resistance 1.2 2.4 Ω Qg Gate Charge Total (4.5V) 7.5 10 nC Qgd Gate Charge Gate to Drain 1.7 nC VDS = 15V, ID = 18A Qgs Gate Charge Gate to Source 2.5 nC Qg(th) Gate Charge at Vth 1.3 nC QOSS Output Charge VDS = 13V, VGS = 0V 15 nC td(on) Turn On Delay Time 6.1 ns tr Rise Time 9.9 ns VDS = 15V, VGS = 4.5V, ID = 18A , RG = 2Ω td(off) Turn Off Delay Time 13.2 ns tf Fall Time 3.6 ns Diode Characteristics VSD Diode Forward Voltage IDS = 18A, VGS = 0V 0.85 1 V Qrr Reverse Recovery Charge 30 nC VDD = 13V, IF = 18A, di/dt = 300A/ms trr Reverse Recovery Time 23 ns THERMAL CHARACTERISTICS (TA = 25°C unless otherwise stated) PARAMETER MIN TYP MAX UNIT RqJC Thermal Resistance Junction to Case(1) 2 °C/W RqJA Thermal Resistance Junction to Ambient(1)(2) 57 °C/W (1) RqJC is determined with the device mounted on a 1-inch 2 (6.45-cm2), Cu pad on a 1.5-inch × 1.5-inch thick FR4 PCB. R qJC is specified by design, whereas RqJA is determined by the user’s board design. (2) Device mounted on FR4 material with 1-inch2 2-oz.Cu. 2 Submit Documentation Feedback Copyright © 2010, Texas Instruments Incorporated Product Folder Link(s): CSD17309Q3 |
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