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BAL99LT1G Datenblatt(PDF) 1 Page - ON Semiconductor |
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BAL99LT1G Datenblatt(HTML) 1 Page - ON Semiconductor |
1 / 3 page © Semiconductor Components Industries, LLC, 2011 September, 2011 − Rev. 6 1 Publication Order Number: BAL99LT1/D BAL99LT1G Switching Diode Features • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant MAXIMUM RATINGS Rating Symbol Value Unit Continuous Reverse Voltage VR 70 Vdc Peak Forward Current IF 100 mAdc Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Total Device Dissipation FR− 5 Board (Note 1), TA = 25°C Derate above 25°C PD 225 1.8 mW mW/°C Thermal Resistance, Junction−to−Ambient RqJA 556 °C/W Total Device Dissipation Alumina Substrate, (Note 2) TA = 25°C Derate above 25°C PD 300 2.4 mW mW/°C Thermal Resistance, Junction−to−Ambient RqJA 417 °C/W Junction and Storage Temperature TJ, Tstg −55 to +150 °C 1. FR−5 = 1.0 0.75 0.062 in. 2. Alumina = 0.4 0.3 0.024 in 99.5% alumina. SOT−23 CASE 318 STYLE 18 http://onsemi.com JF Specific Device Code M = Date Code* G = Pb−Free Package MARKING DIAGRAM ANODE 3 CATHODE 2 1 2 3 Device Package Shipping† ORDERING INFORMATION BAL99LT1G SOT−23 (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. JF MG G (Note: Microdot may be in either location) *Date Code orientation and/or overbar may vary depending upon manufacturing location. |
Ähnliche Teilenummer - BAL99LT1G_11 |
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Ähnliche Beschreibung - BAL99LT1G_11 |
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