Datenblatt-Suchmaschine für elektronische Bauteile |
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FDS4559 Datenblatt(PDF) 3 Page - Fairchild Semiconductor |
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FDS4559 Datenblatt(HTML) 3 Page - Fairchild Semiconductor |
3 / 8 page Electrical Characteristics (continued) T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Type Min Typ Max Units Drain-Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain-Source Diode Forward Current Q1 Q2 1.3 –1.3 A VSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 1.3 A (Note 2) VGS = 0 V, IS = –1.3 A (Note 2) Q1 Q2 0.8 –0.8 1.2 –1.2 V Notes: 1. RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. RθJC is guaranteed by design while RθCA is determined by the user's board design. a) 78°C/W when mounted on a 0.5 in 2 pad of 2 oz copper b) 125°C/W when mounted on a .02 in 2 pad of 2 oz copper c) 135°C/W when mounted on a minimum pad. Scale 1 : 1 on letter size paper 2. Pulse Test: Pulse Width < 300 µs, Duty Cycle < 2.0% FDS4559_F085 Rev A (W) |
Ähnliche Teilenummer - FDS4559_08 |
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Ähnliche Beschreibung - FDS4559_08 |
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