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FAN5622 Datenblatt(PDF) 4 Page - Fairchild Semiconductor

Teilenummer FAN5622
Bauteilbeschribung  Linear LED Drivers with Single-Wire Digital Interface
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Hersteller  FAIRCHILD [Fairchild Semiconductor]
Direct Link  http://www.fairchildsemi.com
Logo FAIRCHILD - Fairchild Semiconductor

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© 2010 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.2
4
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol
Parameter
Min.
Max.
Unit
VCC
VIN Pin
-0.3
6.0
V
Other Pins
(1)
-0.3
VIN +
0.3
V
ESD
Electrostatic Discharge Protection Level
Human Body Model per JESD22-A114
3.0
kV
Charged Device Model per JESD22-C101
1.5
kV
TJ
Junction Temperature
–40
+150
°C
TSTG
Storage Temperature
–65
+150
°C
TL
Lead Soldering Temperature, 10 Seconds
+260
°C
Note:
1. Lesser of 6.0V or VIN+0.3V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to absolute maximum ratings.
Symbol
Parameter
Min.
Max.
Unit
VIN
Power Supply Voltage Range
2.7
5.5
V
TA
Operating Ambient Temperature Range
-40
+85
°C
TJ
Operating Junction Temperature Range
-40
+125
°C
ILED(FS)
Full-Scale LED Current
5
30
mA
Thermal Properties
Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with boards in
accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a given
ambient temperature TA.
Symbol
Parameter
Typical
Unit
JA
Junction-to-Ambient Thermal Resistance, SSOT23-6 Package
235
°C/W
Junction-to-Ambient Thermal Resistance, UMLP10 Package
(2)
287
°C/W
Junction-to-Ambient Thermal Resistance, MicroPak™ MLP10 package
(3)
220
°C/W
Notes:
2. Recommended not to exceed 132mW of maximum power dissipation.
3. Recommended not to exceed 198mW of maximum power dissipation.


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