Datenblatt-Suchmaschine für elektronische Bauteile |
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FAN5622 Datenblatt(PDF) 4 Page - Fairchild Semiconductor |
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FAN5622 Datenblatt(HTML) 4 Page - Fairchild Semiconductor |
4 / 13 page © 2010 Fairchild Semiconductor Corporation www.fairchildsemi.com FAN5622 / FAN5624 / FAN5626 • Rev. 1.0.2 4 Absolute Maximum Ratings Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Min. Max. Unit VCC VIN Pin -0.3 6.0 V Other Pins (1) -0.3 VIN + 0.3 V ESD Electrostatic Discharge Protection Level Human Body Model per JESD22-A114 3.0 kV Charged Device Model per JESD22-C101 1.5 kV TJ Junction Temperature –40 +150 °C TSTG Storage Temperature –65 +150 °C TL Lead Soldering Temperature, 10 Seconds +260 °C Note: 1. Lesser of 6.0V or VIN+0.3V. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol Parameter Min. Max. Unit VIN Power Supply Voltage Range 2.7 5.5 V TA Operating Ambient Temperature Range -40 +85 °C TJ Operating Junction Temperature Range -40 +125 °C ILED(FS) Full-Scale LED Current 5 30 mA Thermal Properties Junction-to-ambient thermal resistance is a function of application and board layout. This data is measured with boards in accordance to JEDEC standard JESD51. Special attention must be paid not to exceed junction temperature TJ(max) at a given ambient temperature TA. Symbol Parameter Typical Unit JA Junction-to-Ambient Thermal Resistance, SSOT23-6 Package 235 °C/W Junction-to-Ambient Thermal Resistance, UMLP10 Package (2) 287 °C/W Junction-to-Ambient Thermal Resistance, MicroPak™ MLP10 package (3) 220 °C/W Notes: 2. Recommended not to exceed 132mW of maximum power dissipation. 3. Recommended not to exceed 198mW of maximum power dissipation. |
Ähnliche Teilenummer - FAN5622 |
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Ähnliche Beschreibung - FAN5622 |
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