Surface Mount Box Contact

SMBC-2-DH SERIES

13 FEB 07

Major League Electronics .079 cl Surface Mount Box Contact - Horizontal

Row Specification

D = Dual Row

Pins Per Row

D

XX

Ordering Information

02

LF

03 - 25

Lead Free

Packing Information

XX

XXX

Horizontal

Polarized Position

Leave blank if not needed

If required, specify empty pin position, e.g. 012 for Pin 12

Surface Mount

H

Plating Options

Matte Tin All Over

T

10µ Gold on Contact Area / Matte Tin on Tail

GT

G

10µ Gold on Contact Area / Flash on Tail

30µ Gold on Contact Area / Matte Tin on Tail

H

Gold Flash over Entire Pin

F

TR = Tape and Reel

TB = Tube

If left blank, packaging at MLE's discretion

4235 Earnings Way, New Albany, Indiana, 47150, USA

1-800-782-3486 (USA/Canada/Mexico)

Tel: 812-944-7244

Fax: 812-944-7268

E-mail: mle@mlelectronics.com

Web: www.mlelectronics.com

Specifications

Insertion Force - Single Contact only - H Plating:

3.7oz. (1,03N) avg with .0197 (0,50mm) sq. pin

Withdrawal Force - Single Contact only - H Plating:

2.2oz. (0,61N) avg with .0197 (0,50mm) sq. pin

Current Rating: 2.0 Ampere

Insulation Resistance: 1000MΩ Min.

Dielectric Withstanding: 500V AC

Contact Resistance: 20 mΩ Max.

Operating Temperature: -40°C to + 105°C

Max. Process Temperature:

Peak: 260°C up to 10 secs.

Process: 230°C up to 60 secs.

Wave: 260°C up to 6 secs.

Reflow: 260°C up to 10 secs.

Manual Solder: 350°C up to 5 secs.

Materials

Contact Material: Phosphor Bronze

Insulator Material: Nylon 6T

Plating: Au or Sn over 50µ" (1,27) Ni

Products cut to specific sizes are uncancellable/nonreturnable

Parts are subject to change without notice

Mates with:

BSTC,

BSTCM,

BSTCR,

BSTCRSM,

BSTS,

TBSTC,

TBSTCM,

TBSTS,

TBSTCM,

TBSTS,

TSHC,

TSHCR,

TSHCRE,

TSHCRSM,

TSHR,

TSHRE,

TSHS,

TSHSCM,

TTSHC,

TTSHCR,

TTSHCRE,

TTSHR,

TTSHRE,

TTSHS,

TTSHSM