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ADP1190ACBZ-R7 Datenblatt(PDF) 4 Page - Analog Devices

Teilenummer ADP1190ACBZ-R7
Bauteilbeschribung  Integrated 500 mA Load Switch with Quad Signal Switch
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Hersteller  AD [Analog Devices]
Direct Link  http://www.analog.com
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ADP1190ACBZ-R7 Datenblatt(HTML) 4 Page - Analog Devices

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ADP1190
Data Sheet
Rev. 0 | Page 4 of 12
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
IN to GND
−0.3 V to +4.0 V
OUT to GND
−0.3 V to VIN
Sx to GND
−0.3 V to +4.0 V
Tx to GND
−0.3 V to +4.0 V
EN to GND
−0.3 V to +4.0 V
Continuous Load Switch Current
TA = 25°C
±1 A
TA = 85°C
±500 mA
Continuous Diode Current
−50 mA
Storage Temperature Range
−65°C to +150°C
Junction Temperature
+150°C
Operating Junction Temperature Range
−40°C to +125°C
Operating Ambient Temperature Range
−40°C to +85°C
Soldering Conditions
JEDEC J-STD-020
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL DATA
Absolute maximum ratings apply individually only, not in
combination. The ADP1190 can be damaged when the junction
temperature limits are exceeded. Monitoring ambient tempera-
ture does not guarantee that TJ is within the specified temperature
limits. In applications with high power dissipation and poor
thermal resistance, the maximum ambient temperature may
need to be derated.
In applications with moderate power dissipation and low PCB
thermal resistance, the maximum ambient temperature can
exceed the maximum limit as long as the junction temperature
is within specification limits. The junction temperature (TJ) of
the device is dependent on the ambient temperature (TA), the
power dissipation of the device (PD), and the junction-to-ambient
thermal resistance of the package (θJA).
Maximum junction temperature (TJ) is calculated from the
ambient temperature (TA) and power dissipation (PD) using the
formula
TJ = TA + (PD × θJA)
The junction-to-ambient thermal resistance (θJA) of the package
is based on modeling and calculation using a 4-layer board. The
junction-to-ambient thermal resistance is highly dependent on
the application and board layout. In applications where high maxi-
mum power dissipation exists, close attention to thermal board
design is required. The value of θJA may vary, depending on
PCB material, layout, and environmental conditions. The speci-
fied value of θJA is based on a 4-layer, 4 in. × 3 in. circuit board. See
JESD51-7 and JESD51-9 for detailed information on the board
construction. For additional information, see the AN-617
Application Note, Wafer Level Chip Scale Package, available at
www.analog.com.
ΨJB is the junction-to-board thermal characterization parameter
with units of °C/W. ΨJB of the package is based on modeling and
calculation using a 4-layer board. JESD51-12, Guidelines for
Reporting and Using Electronic Package Thermal Information,
states that thermal characterization parameters are not the same
as thermal resistances. ΨJB measures the component power
flowing through multiple thermal paths rather than through a
single path as in thermal resistance, θJB. Therefore, ΨJB thermal
paths include convection from the top of the package as well as
radiation from the package, factors that make ΨJB more useful
in real-world applications. Maximum junction temperature (TJ)
is calculated from the board temperature (TB) and power
dissipation (PD) using the formula
TJ = TB + (PD × ΨJB)
See JESD51-8 and JESD51-12 for more detailed information
about ΨJB.
THERMAL RESISTANCE
θJA and ΨJB are specified for the worst-case conditions, that is, a
device soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
θJA
ΨJB
Unit
12-Ball WLCSP
130
29.2
°C/W
ESD CAUTION


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