Datenblatt-Suchmaschine für elektronische Bauteile |
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FDC5614P Datenblatt(PDF) 2 Page - Fairchild Semiconductor |
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FDC5614P Datenblatt(HTML) 2 Page - Fairchild Semiconductor |
2 / 5 page FDC5614P Rev C1 (W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA –60 V ∆BVDSS ∆TJ Breakdown Voltage Temperature Coefficient ID = –250 µA, Referenced to 25 °C –49 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = –48 V, VGS = 0 V –1 µA IGSSF Gate–Body Leakage, Forward VGS = 20V, VDS = 0 V 100 nA IGSSR Gate–Body Leakage, Reverse VGS = –20 V VDS = 0 V –100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = –250 µA –1 –1.6 –3 V ∆VGS(th) ∆TJ Gate Threshold Voltage Temperature Coefficient ID = –250 µA,Referenced to 25°C 4 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = –10 V, ID = –3 A VGS = –4.5 V, ID = –2.7 A VGS = –10 V, ID = –3 A TJ=125 °C 82 105 130 105 135 190 m Ω ID(on) On–State Drain Current VGS = –10 V, VDS = –5 V –20 A gFS Forward Transconductance VDS = –5 V, ID = –3 A 8 S Dynamic Characteristics Ciss Input Capacitance 759 pF Coss Output Capacitance 90 pF Crss Reverse Transfer Capacitance VDS = –30 V, V GS = 0 V, f = 1.0 MHz 39 pF Switching Characteristics (Note 2) td(on) Turn–On Delay Time 7 14 ns tr Turn–On Rise Time 10 20 ns td(off) Turn–Off Delay Time 19 34 ns tf Turn–Off Fall Time VDD = –30 V, ID = –1 A, VGS = –10 V, RGEN = 6 Ω 12 22 ns Qg Total Gate Charge 15 24 nC Qgs Gate–Source Charge 2.5 nC Qgd Gate–Drain Charge VDS = –30V, ID = –3.0 A, VGS = –10 V 3.0 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current –1.3 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = –1.3 A (Note 2) –0.8 –1.2 V Notes: 1. R θJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θJC is guaranteed by design while RθCA is determined by the user's board design. a. 78°C/W when mounted on a 1in 2 pad of 2oz copper on FR-4 board. b. 156°C/W when mounted on a minimum pad. 2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0% |
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Ähnliche Beschreibung - FDC5614P |
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