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Datenblatt-Suchmaschine für elektronische Bauteile |
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Datenblatt-Suchmaschine für elektronische Bauteile |
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FDC604 Datenblatt(PDF) 2 Page - Fairchild Semiconductor |
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FDC604 Datenblatt(HTML) 2 Page - Fairchild Semiconductor |
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2 / 8 page  FDC604P Rev B(W) Electrical Characteristics T A = 25°C unless otherwise noted Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain–Source Breakdown Voltage VGS = 0 V, ID = –250 µA –20 V ∆BVDSS ===∆TJ Breakdown Voltage Temperature Coefficient ID = –250 µA,Referenced to 25°C –12 mV/ °C IDSS Zero Gate Voltage Drain Current VDS = –16 V, VGS = 0 V –1 µA IGSSF Gate–Body Leakage, Forward VGS = 8 V, VDS = 0 V 100 nA IGSSR Gate–Body Leakage, Reverse VGS = –8 V VDS = 0 V –100 nA On Characteristics (Note 2) VGS(th) Gate Threshold Voltage VDS = VGS, ID = –250 µA –0.4 –0.7 –1.5 V ∆VGS(th) ===∆TJ Gate Threshold Voltage Temperature Coefficient ID = –250 µA,Referenced to 25°C 3 mV/ °C RDS(on) Static Drain–Source On–Resistance VGS = –4.5 V, ID = –5.5 A VGS = –2.5 V, ID = –4.8 A VGS = –1.8 V, ID = –4.0 A 0.024 0.030 0.042 0.033 0.043 0.060 Ω ID(on) On–State Drain Current VGS = –4.5 V, VDS = –5 V –20 A gFS Forward Transconductance VDS = –5 V, ID = –3.5 A 23 S Dynamic Characteristics Ciss Input Capacitance 1926 pF Coss Output Capacitance 530 pF Crss Reverse Transfer Capacitance VDS = –10 V, V GS = 0 V, f = 1.0 MHz 185 pF Switching Characteristics (Note 2) td(on) Turn–On Delay Time 13 23 ns tr Turn–On Rise Time 11 20 ns td(off) Turn–Off Delay Time 90 144 ns tf Turn–Off Fall Time VDD = –10 V, ID = –1 A, VGS = –4.5 V, RGEN = 6 Ω 45 72 ns Qg Total Gate Charge 19 30 nC Qgs Gate–Source Charge 4 nC Qgd Gate–Drain Charge VDS = –10 V, ID = –3.5 A, VGS = –4.5 V 7.5 nC Drain–Source Diode Characteristics and Maximum Ratings IS Maximum Continuous Drain–Source Diode Forward Current –1.3 A VSD Drain–Source Diode Forward Voltage VGS = 0 V, IS = –1.3 A (Note 2) –0.7 –1.2 V Notes: 1. R θJA is the sum of the junction-to-case and case-to-ambient resistance where the case thermal reference is defined as the solder mounting surface of the drain pins. R θJC is guaranteed by design while RθCA is determined by the user's board design. a. 78°C/W when mounted on a 1in 2 pad of 2oz copper on FR-4 board. b. 156°C/W when mounted on a minimum pad. 2. Pulse Test: Pulse Width ≤=300 µs, Duty Cycle ≤=2.0% |
Ähnliche Teilenummer - FDC604 |
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Ähnliche Beschreibung - FDC604 |
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