FDC638P Rev.B

Figure 10. Single Pulse Maximum Power

Dissipation.

0.1

0.3

1

3

10

20

50

100

200

400

1000

2500

-V

, DRAIN TO SOURCE VOLTAGE (V)

DS

Ciss

f = 1 MHz

V

= 0 V

GS

Coss

Crss

Figure 7. Gate Charge Characteristics.

Figure 9. Maximum Safe Operating Area.

Typical Electrical Characteristics

0

3

6

9

12

15

0

1

2

3

4

5

Q

, GATE CHARGE (nC)

g

V

= -5V

DS

-10V

I

= -4.5A

D

-15V

0.1

0.2

0.5

1

2

5

10

30

0.01

0.05

0.3

1

5

30

- V

, DRAIN-SOURCE VOLTAGE (V)

RDS(ON)

LIMIT

A

DC

DS

1s

100ms

10ms

1ms

V

= -4.5V

SINGLE PULSE

R

=156 °C/W

T

= 25°C

θJA

GS

A

100us

0.01

0.1

1

10

100

300

0

1

2

3

4

5

SINGLE PULSE TIME (SEC)

SINGLE PULSE

R

=156°C/W

T = 25°C

θJA

A

0.00001

0.0001

0.001

0.01

0.1

1

10

100

300

0.005

0.01

0.02

0.05

0.1

0.2

0.5

1

t , TIME (sec)

1

Single Pulse

D = 0.5

0.1

0.05

0.02

0.01

0.2

Duty Cycle, D = t / t

1

2

R

(t) = r(t) * R

R

= 156°C/W

T - T

= P * R

(t)

A

J

P(pk)

θJA

θJA

θJA

θJA

Figure 11. Transient Thermal Response Curve.

Thermal characterization performed using the conditions described in Note 1b.

Transient thermal response will change depending on the circuit board design.