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ST10 Datenblatt(PDF) 1 Page - AVX Corporation

Teilenummer ST10
Bauteilbeschribung  Mini-TurboCapTM Small Footprint, High Volumetric Efficiency, High-CV SMPS Capacitors
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Hersteller  AVX [AVX Corporation]
Direct Link  http://www.avx.com
Logo AVX - AVX Corporation

ST10 Datenblatt(HTML) 1 Page - AVX Corporation

  ST10 Datasheet HTML 1Page - AVX Corporation ST10 Datasheet HTML 2Page - AVX Corporation  
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ELECTRICAL SPECIFICATIONS
HOW TO ORDER
ST10
AVX
Style
5
Voltage
50V = 5
100V = 1
C
Temperature
Coefficient
X7R = C
186
Capacitance Code
(2 significant digits
+ no. of zeros)
1 μF = 105
10 μF = 106
M
Capacitance
Tolerance
M = ±20%
A
Test Level
A = Standard
K
Termination
N = Straight Lead
K = Leads formed in
M = Leads formed out
02
Number
of Leads
Per Side
02 = 2
CAPACITANCE RANGE
Temperature Coefficient
±15%, -55° to +125°C
Capacitance Test (MIL-STD-202, Method 305)
25°C, 1.0±0.2 Vrms (open circuit voltage) at 1KHz
Dissipation Factor
5% Max @ 25°C, for 50VDC and 100VDC voltage ratings
Insulation Resistance 25°C (MIL-STD-202, Method 302)
500 MΩ-μF
Insulation Resistance 125°C (MIL-STD-202, Method 302)
50 MΩ-μF
Dielectric Withstanding Voltage 25°C (Flash Test)
250% rated voltage for 5 seconds with 50 mA max charging current.
Life Test Capabilities (1000 hrs)
150% rated voltage at +125°C.
Mini-TurboCap
TM
Small Footprint, High Volumetric Efficiency,
High-CV SMPS Capacitors
VOLTAGE
Style
50V
100V
ST10
18 μF
8.2 μF
The Mini-TurboCap is constructed from state-of-the-art BME
(Base Metal Electrode) MLC Capacitors achieving very high
CV, as well as, ultra low ESR and ESL. The resulting, very
large capacitance values allow for component and board
space reduction. Stress relieving lead frames provide effective
mechanical decoupling of the ceramic chips from the board,
minimizing the stress created by board flexing, vibration and
temperature cycling.
High temperature solder is used to
attach chips to the lead frame thus eliminating the risk of
solder reflow during assembly to the board.


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