TC4426AM/TC4427AM/TC4428AM

DS21939B-page 10

 2005-2013 Microchip Technology Inc.

8-Lead Ceramic Dual In-line – 300 mil (CERDIP)

10.16

9.15

8.13

.400

.360

.320

eB

Overall Row Spacing

0.51

0.46

0.41

.020

.018

.016

B

Lower Lead Width

1.65

1.40

1.14

.065

.055

.045

B1

Upper Lead Width

0.38

0.29

0.20

.015

.012

.008

c

Lead Thickness

5.08

4.13

3.18

.200

.163

.125

L

Tip to Seating Plane

10.16

9.78

9.40

.400

.385

.370

D

Overall Length

7.62

6.73

5.84

.300

.265

.230

E1

Ceramic Pkg. Width

8.13

7.75

7.37

.320

.305

.290

E

Shoulder to Shoulder Width

1.02

0.77

0.51

.040

.030

.020

A1

Standoff §

5.08

4.57

4.06

.200

.180

.160

A

Top to Seating Plane

2.54

.100

p

Pitch

8

8

n

Number of Pins

MAX

NOM

MIN

MAX

NOM

MIN

Dimension Limits

MILLIMETERS

INCHES*

Units

JEDEC Equivalent: MS-030

Drawing No. C04-010

*Controlling Parameter

1

2

D

n

E1

c

eB

E

p

L

A2

B

B1

A

A1

Note:

For the most current package drawings, please see the Microchip Packaging Specification located

at http://www.microchip.com/packaging