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AD830JR-REEL Datenblatt(PDF) 7 Page - Analog Devices |
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AD830JR-REEL Datenblatt(HTML) 7 Page - Analog Devices |
7 / 20 page AD830 Rev. C | Page 7 of 20 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating Supply Voltage ±18 V Internal Power Dissipation Observe derating curves Output Short-Circuit Duration Observe derating curves Common-Mode Input Voltage ±VS Differential Input Voltage ±VS Storage Temperature Range (Q) −65°C to +150°C Storage Temperature Range (N) −65°C to +125°C Storage Temperature Range (RN) −65°C to +125°C Operating Temperature Range AD830J 0°C to +70°C AD830A −40°C to +85°C AD830S −55°C to +125°C Lead Temperature Range (Soldering 60 sec) 300°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. MAXIMUM POWER DISSIPATION The maximum power that can be safely dissipated by the AD830 is limited by the associated rise in junction temperature. For the plastic packages, the maximum safe junction temperature is 145°C. For the CERDIP, the maximum junction temperature is 175°C. If these maximums are exceeded momentarily, proper circuit operation will be restored as soon as the die temperature is reduced. Leaving the AD830 in the overheated condition for an extended period can result in permanent damage to the device. To ensure proper operation, it is important to observe the recommended derating curves. While the AD830 output is internally short-circuit protected, this may not be sufficient to guarantee that the maximum junction temperature is not exceeded under all conditions. If the output is shorted to a supply rail for an extended period, then the amplifier may be permanently destroyed. THERMAL RESISTANCE θJA is specified for the worst-case conditions, that is, a device soldered in a circuit board for surface-mount packages. Table 4. Thermal Resistance Package Type θJA Unit 28-Lead PDIP Package 90 °C/W 8-Lead SOIC Package 155 °C/W 8-Lead CERDIP Package 11 °C/W ESD CAUTION 2.5 0 90 1.5 0.5 –30 1.0 –50 2.0 70 50 30 10 –10 AMBIENT TEMPERATURE (°C) TJ MAX = 145°C 8-LEAD PDIP 8-LEAD SOIC 2.8 0.2 140 0.8 0.4 –40 0.6 –60 1.4 1.0 1.2 1.6 2.0 2.2 2.6 2.4 1.8 100 120 80 60 40 20 0 –20 AMBIENT TEMPERATURE (°C) 8-LEAD CERDIP TJ MAX = 175°C Figure 4. Maximum Power Dissipation vs. Temperature, PDIP and SOIC Packages Figure 5. Maximum Power Dissipation vs. Temperature, CERDIP Package |
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Ähnliche Beschreibung - AD830JR-REEL |
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