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LM2941SX Datenblatt(PDF) 4 Page - Texas Instruments

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Teilenummer LM2941SX
Bauteilbeschribung  LM2941/LM2941C 1A Low Dropout Adjustable Regulator
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
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LM2941, LM2941C
SNVS770G – JUNE 1999 – REVISED APRIL 2013
www.ti.com
Electrical Characteristics—LM2941CT, LM2941CS (continued)
5V
≤ VO ≤ 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C,
while those in boldface type apply over the full Operating Temperature Range.
Limit
Units
Parameter
Conditions
Typ
(1)
(Limits)
Maximum Line
VO Max 1V Above Nominal VO
55
45
V(min)
Transient
RO = 100Ω, T ≤ 100ms
Maximum Operational
31
26
VDC
Input Voltage
Reverse Polarity
RO = 100Ω, VO ≥ −0.6V
−30
−15
V(min)
DC Input Voltage
Reverse Polarity
T
≤ 100ms, RO = 100Ω
−55
−45
V(min)
Transient Input Voltage
ON/OFF Threshold
IO ≤ 1A
1.30
0.80
V(max)
Voltage ON
ON/OFF Threshold
IO ≤ 1A
1.30
2.00
V(min)
Voltage OFF
ON/OFF Threshold
VON/OFF = 2.0V, IO ≤ 1A
50
100
μA(max)
Current
Thermal Performance
Thermal Resistance
5-Lead TO-220
1
°C/W
Junction-to-Case,
θJC
5-Lead TO-263
1
°C/W
8-Lead WSON
5.3
°C/W
Thermal Resistance
5-Lead TO-220
53
°C/W
Junction-to-Ambient,
θJA
(1)
5-Lead TO-263 (See TO-263 Mounting)
73
°C/W
8-Lead WSON (See WSON Mounting)
35
°C/W
(1)
The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (TJ(max) − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go
into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area
thermally connected to the package: Using 0.5 square inches of copper area,
θJA is 50°C/W; with 1 square inch of copper area, θJA is
37°C/W; and with 1.6 or more square inches of copper area,
θJA is 32°C/W. Thermal performance for the WSON package was obtained
using a JESD51-7 board with six vias, using no airflow and an ambient temperature of 22°C. The value
θJA for the WSON package is
specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance
and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). It is recommended that
6 vias be placed under the center pad to improve thermal performance.
4
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM2941 LM2941C


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