Datenblatt-Suchmaschine für elektronische Bauteile |
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LM2941SX Datenblatt(PDF) 4 Page - Texas Instruments |
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LM2941SX Datenblatt(HTML) 4 Page - Texas Instruments |
4 / 26 page LM2941, LM2941C SNVS770G – JUNE 1999 – REVISED APRIL 2013 www.ti.com Electrical Characteristics—LM2941CT, LM2941CS (continued) 5V ≤ VO ≤ 20V, VIN = VO + 5V, CO = 22μF, unless otherwise specified. Specifications in standard typeface apply for TJ = 25°C, while those in boldface type apply over the full Operating Temperature Range. Limit Units Parameter Conditions Typ (1) (Limits) Maximum Line VO Max 1V Above Nominal VO 55 45 V(min) Transient RO = 100Ω, T ≤ 100ms Maximum Operational 31 26 VDC Input Voltage Reverse Polarity RO = 100Ω, VO ≥ −0.6V −30 −15 V(min) DC Input Voltage Reverse Polarity T ≤ 100ms, RO = 100Ω −55 −45 V(min) Transient Input Voltage ON/OFF Threshold IO ≤ 1A 1.30 0.80 V(max) Voltage ON ON/OFF Threshold IO ≤ 1A 1.30 2.00 V(min) Voltage OFF ON/OFF Threshold VON/OFF = 2.0V, IO ≤ 1A 50 100 μA(max) Current Thermal Performance Thermal Resistance 5-Lead TO-220 1 °C/W Junction-to-Case, θJC 5-Lead TO-263 1 °C/W 8-Lead WSON 5.3 °C/W Thermal Resistance 5-Lead TO-220 53 °C/W Junction-to-Ambient, θJA (1) 5-Lead TO-263 (See TO-263 Mounting) 73 °C/W 8-Lead WSON (See WSON Mounting) 35 °C/W (1) The maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ(max) − TA)/θJA. If this dissipation is exceeded, the die temperature will rise above 150°C and the LM2941 will go into thermal shutdown. If the TO-263 package is used, the thermal resistance can be reduced by increasing the P.C. board copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more square inches of copper area, θJA is 32°C/W. Thermal performance for the WSON package was obtained using a JESD51-7 board with six vias, using no airflow and an ambient temperature of 22°C. The value θJA for the WSON package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 (literature number SNOA401). It is recommended that 6 vias be placed under the center pad to improve thermal performance. 4 Submit Documentation Feedback Copyright © 1999–2013, Texas Instruments Incorporated Product Folder Links: LM2941 LM2941C |
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