Datenblatt-Suchmaschine für elektronische Bauteile |
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LM2941SX Datenblatt(PDF) 11 Page - Texas Instruments |
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LM2941SX Datenblatt(HTML) 11 Page - Texas Instruments |
11 / 26 page 0 20 40 60 80 100 0 1 2 3 4 5 6 AMBIENT TEMPERATURE (°C) LM2941LD (LLP) JA= 35°C/W JA= 40°C/W JA= 49°C/W JA= 58°C/W LM2941, LM2941C www.ti.com SNVS770G – JUNE 1999 – REVISED APRIL 2013 For the LM2941LD in the NGN 8-Lead WSON package, the junction-to-case thermal rating, θJC, is 5.3°C/W, where the CASE is defined as the bottom of the package at the center of the DAP area. The junction-to-ambient thermal performance for the LM2941LD in the NGN 8-Lead WSON package, using the JEDEC JESD51 standards is summarized in the following table: Board Thermal θJC θJA Type Vias JEDEC 2-Layer None 5.3°C/W 181°C/W JESD 51-3 1 5.3°C/W 58°C/W JEDEC 2 5.3°C/W 49°C/W 4-Layer 4 5.3°C/W 40°C/W JESD 51-7 6 5.3°C/W 35°C/W Figure 22. PD(MAX) vs TA for LM2941LD (WSON) Copyright © 1999–2013, Texas Instruments Incorporated Submit Documentation Feedback 11 Product Folder Links: LM2941 LM2941C |
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