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ADMP510 Datenblatt(PDF) 9 Page - Analog Devices

Teilenummer ADMP510
Bauteilbeschribung  RF Hardened, Ultralow Noise Microphone with Bottom Port and Analog Output
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ADMP510 Datenblatt(HTML) 9 Page - Analog Devices

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Data Sheet
ADMP510
Rev. 0 | Page 9 of 12
HANDLING INSTRUCTIONS
PICK-AND-PLACE EQUIPMENT
The MEMS microphone can be handled using standard pick-
and-place and chip shooting equipment. Take care to avoid
damage to the MEMS microphone structure as follows:
Use a standard pickup tool to handle the microphone.
Because the microphone hole is located on the bottom
surface of the package (see Figure 2), the pickup tool can
make contact with any part of the top lid surface.
Do not pick up the microphone with a vacuum tool that
makes contact with the bottom side of the microphone.
Do not use excessive force to place the microphone on
the PCB.
REFLOW SOLDER
For best results, the soldering profile should be in accordance
with the recommendations of the manufacturer of the solder
paste used to attach the MEMS microphone to the PCB. It is
recommended that the solder reflow profile not exceed the limit
conditions specified in Figure 3 and Table 3.
BOARD WASH
When washing the PCB, ensure that water does not make contact
with the microphone port. Do not use blow-off procedures or
ultrasonic cleaning.


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