Datenblatt-Suchmaschine für elektronische Bauteile |
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SMA6F13A Datenblatt(PDF) 5 Page - STMicroelectronics |
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SMA6F13A Datenblatt(HTML) 5 Page - STMicroelectronics |
5 / 9 page SMA6F Characteristics Doc ID 14996 Rev 2 5/9 Figure 6. Peak forward voltage drop versus peak forward current (typical values) Figure 7. Relative variation of thermal impedance junction to ambient versus pulse duration Figure 8. Thermal resistance junction to ambient versus copper surface under each lead Figure 9. Leakage current versus junction temperature (typical values) I (A) FM 1.0E-02 1.0E-01 1.0E+00 1.0E+01 1.0E+02 0.0 0.5 1.0 1.5 2.0 T j =25 °C T j =125 °C V (V) FM Zth(j-a)/Rth(j-a) 0.00 0.01 0.10 1.00 1.0E-03 1.0E-021.0E-011.0E+00 1.0E+011.0E+021.0E+03 On recommended pad layout. Printed circuit board, FR4 copper thickness = 35 µm copper surface = 1 cm² t (S) p Rth(j-a)(°C/W) 0 20 40 60 80 100 120 140 160 180 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 S (cm ) CU 2 Printed circuit board, FR4 copper thickness = 35 µm I (nA) R 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 25 50 75 100 125 150 175 V R=VRM V BR=11.7V V BR>11.7V T (°C) j |
Ähnliche Teilenummer - SMA6F13A |
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Ähnliche Beschreibung - SMA6F13A |
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