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SL3S1002FTB1,115 Datenblatt(PDF) 8 Page - NXP Semiconductors |
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SL3S1002FTB1,115 Datenblatt(HTML) 8 Page - NXP Semiconductors |
8 / 51 page 139037 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved. Product data sheet COMPANY PUBLIC Rev. 3.7 — 9 October 2012 139037 8 of 51 NXP Semiconductors SL3ICS1002/1202 UCODE G2XM and G2XL Fig 4. Package outline SOT1122 References Outline version European projection Issue date IEC JEDEC JEITA SOT1122 MO-252 sot1122_po Unit mm max nom min 0.50 0.04 0.55 0.425 0.30 0.25 0.22 0.35 0.30 0.27 A(1) Dimensions Notes 1. Dimension A is including plating thickness. 2. Can be visible in some manufacturing processes. SOT1122 A1 D 1.50 1.45 1.40 1.05 1.00 0.95 Ee e1 0.55 0.50 0.47 0.45 0.40 0.37 bb1 LL1 09-10-09 XSON3: plastic extremely thin small outline package; no leads; 3 terminals; body 1 x 1.45 x 0.5 mm D E e1 e A1 b1 L1 L e1 0 1 2 mm scale 3 1 2 b 4 × (2) 4 × (2) A pin 1 indication type code terminal 1 index area |
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