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BU1CTD3WG-GTR Datenblatt(PDF) 8 Page - Rohm

Teilenummer BU1CTD3WG-GTR
Bauteilbeschribung  Versatile Package FULL CMOS LDO Regulator
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Hersteller  ROHM [Rohm]
Direct Link  http://www.rohm.com
Logo ROHM - Rohm

BU1CTD3WG-GTR Datenblatt(HTML) 8 Page - Rohm

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TSZ02201-0RBR0A300030-1-2
TSZ22111・15・001
8/10
30.JUL.2013.Rev.002
BUxxTD3WG series
Datasheet
About power dissipation (Pd)
As for power dissipation, an approximate estimate of the heat reduction characteristics and internal power consumption of
IC are shown, so please use these for reference. Since power dissipation changes substantially depending on the
implementation conditions (board size, board thickness, metal wiring rate, number of layers and through holes, etc.), it is
recommended to measure Pd on a set board. Exceeding the power dissipation of IC may lead to deterioration of the
original IC performance, such as causing operation of the thermal shutdown circuit or reduction in current capability.
Therefore, be sure to prepare sufficient margin within power dissipation for usage.
Calculation of the maximum internal power consumption of IC (PMAX)
PMAX=(VIN-VOUT)×IOUT(MAX.)
(VIN: Input voltage VOUT: Output voltage IOUT(MAX): Maximum output current)
Measurement conditions
Standard ROHM Board
Layout of Board for
Measurement
IC
Implementation
Position
Top Layer (Top View)
Bottom Layer (Top View)
Measurement State
With board implemented (Wind speed 0 m/s)
Board Material
Glass epoxy resin (Double-side board)
Board Size
70 mm x 70 mm x 1.6 mm
Wiring
Rate
Top layer
Metal (GND) wiring rate: Approx. 0%
Bottom
layer
Metal (GND) wiring rate: Approx. 50%
Through Hole
Diameter 0.5mm x 6 holes
Power Dissipation
0.54W
Thermal Resistance
θja=185.2°C/W
* Please design the margin so that
PMAX becomes is than Pd (PMAX
<Pd)
within the usage temperature range
Fig. 28 SSOP5 Power dissipation heat reduction characteristics (Reference)
0
0.1
0.2
0.3
0.4
0.5
0.6
0
25
50
75
100
125
Ta [℃]
0.54W
85
Standard ROHM
Board


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