Datenblatt-Suchmaschine für elektronische Bauteile |
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HLMP-AH62-X10DD Datenblatt(PDF) 9 Page - AVAGO TECHNOLOGIES LIMITED |
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HLMP-AH62-X10DD Datenblatt(HTML) 9 Page - AVAGO TECHNOLOGIES LIMITED |
9 / 11 page 9 Example of Wave Soldering Temperature Profile for TH LED Ammo Packs Drawing 0 30 40 90 100 250 200 150 100 50 TIME (MINUTES) PREHEAT TURBULENT WAVE LAMINAR WAVE HOT AIR KNIFE Recommended solder: Sn63 (Leaded solder alloy) SAC305 (Lead free solder alloy) Flux: Rosin flux Solder bath temperature: 245°C± 5°C (maximum peak temperature = 250°C) Dwell time: 1.5 sec - 3.0 sec (maximum = 3sec) Note: Allow for board to be sufficiently cooled to room temperature before exerting 10 20 60 70 80 50 mechanical force. 6.35±1.30 0.25±0.0512 12.70±1.00 0.50±0.0394 20.50±1.00 0.8071±0.0394 4.00±0.20 0.1575±0.008 0.70±0.20 0.0276±0.0079 12.70±0.30 0.50±0.0118 9.125±0.625 0.3593±0.0246 18.00±0.50 0.7087±0.0197 TYP Ø VIEW A - A A A CATHODE |
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Ähnliche Beschreibung - HLMP-AH62-X10DD |
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