10

Rev. 1.2

Si860x

Table 7. Insulation and Safety-Related Specifications

Parameter

Symbol

Test Condition

Value

Unit

NB

SOIC-8

NB

SOIC-16

WB

SOIC-16

Nominal Air Gap (Clearance)1

L(1O1)

4.9

4.9

8.0

mm

Nominal External Tracking

(Creepage)1

L(1O2)

4.01

4.01

8.0

mm

Minimum Internal Gap

(Internal Clearance)

0.011

0.011

0.014

mm

Tracking Resistance

(Proof Tracking Index)

PTI

IEC60112

600

600

600

Erosion Depth

ED

0.040

0.019

0.019

mm

Resistance (Input-Output)2



Capacitance (Input-Output)2

f = 1 MHz

1.0

2.0

2.0

pF

Input Capacitance3

4.0

4.0

4.0

pF

10

10

10

pF

Notes:

1. VDE certifies the clearance and creepage limits as 4.7 mm minimum for the NB SOIC-8 and SOIC-16 packages and

8.5 mm minimum for the WB SOIC-16 package. UL does not impose a clearance and creepage minimum for

component level certifications. CSA certifies the clearance and creepage limits as 3.9 mm minimum for the NB SOIC-8

and SOIC-16 packages and 7.6 mm minimum for the WB SOIC-16 package.

2. To determine resistance and capacitance, the Si860x, SO-16, is converted into a 2-terminal device. Pins 1–8 (1–4, SO-

8) are shorted together to form the first terminal and pins 9–16 (5–8, SO-8) are shorted together to form the second

terminal. The parameters are then measured between these two terminals.

3. Measured from input pin to ground.

Table 8. IEC 60664-1 (VDE 0844 Part 2) Ratings

Parameter

Test Conditions

Specification

NB SOIC-8

SOIC-16

WB SOIC-16

Basic Isolation Group

Material Group

I

I

Installation Classification

I-IV

I-IV

I-III

I-IV

I-II

I-III

I-II

I-III