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74AUP1G125DBVRE4 Datenblatt(PDF) 2 Page - Texas Instruments

Teilenummer 74AUP1G125DBVRE4
Bauteilbeschribung  LOW-POWER SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

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Time − ns
AUP1G08 data at CL = 15 pF
Output
Input
Switching Characteristics
at 25 MHz
AUP
LVC
AUP
AUP
LVC
Static-Power Consumption
(
µA)
Dynamic-Power Consumption
(pF)
Single, dual, and triple gates
3.3-V
Logic
3.3-V
Logic
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20%
40%
60%
80%
100%
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20%
40%
60%
80%
100%
SN74AUP1G125
SCES595L – JULY 2004 – REVISED FEBRUARY 2013
www.ti.com
This bus buffer gate is a single line driver with a 3-state output. The output is disabled when the output-enable
(OE) input is high. This device has the input-disable feature, which allows floating input signals.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Figure 1. AUP – The Lowest-Power Family
Figure 2. Excellent Signal Integrity
NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION(1)
TOP-SIDE
TA
PACKAGE(2)
ORDERABLE PART NUMBER
MARKING(3)
NanoStar™ – WCSP (DSBGA)
Reel of 3000
SN74AUP1G125YFPR
_ _ _ HM _
0.23-mm Large Bump – YFP (Pb-free)
NanoStar™ – WCSP (DSBGA)
Reel of 3000
SN74AUP1G125YZPR
_ _ _ HM _
0.23-mm Large Bump – YZP (Pb-free)
NanoStar™ – WCSP (DSBGA)
Reel of 3000
SN74AUP1G125YZTR
_ _ _ HM _
0.23-mm Large Bump – YZT (Pb-free)
QFN – DRY
Reel of 5000
SN74AUP1G125DRYR
HM
–40°C to 85°C
uQFN – DSF
Reel of 5000
SN74AUP1G125DSFR
HM
Reel of 3000
SN74AUP1G125DBVR
SOT (SOT-23) – DBV
H25_
Reel of 250
SN74AUP1G125DBVT
Reel of 3000
SN74AUP1G125DCKR
SOT (SC-70) – DCK
HM_
Reel of 250
SN74AUP1G125DCKT
SOT (SOT-553) – DRL
Reel of 4000
SN74AUP1G125DRLR
HM_
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2)
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3)
DBV/DCK/DRL: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
YFP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
FUNCTION TABLE
INPUTS
OUTPUT
Y
OE
A
L
H
H
L
L
L
H
X(1)
Z
(1)
Floating inputs allowed.
2
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Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: SN74AUP1G125


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