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AMC1200STDUBRQ1 Datenblatt(PDF) 3 Page - Texas Instruments

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Teilenummer AMC1200STDUBRQ1
Bauteilbeschribung  Fully Differential Isolation Amplifier
Download  23 Pages
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Hersteller  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

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AMC1200-Q1
www.ti.com
SBAS585 – SEPTEMBER 2012
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE/ORDERING INFORMATION
For the most current package and ordering information see the Package Option Addendum at the end of this
document, or visit the device product folder on www.ti.com.
ABSOLUTE MAXIMUM RATINGS
(1)
Over the operating ambient temperature range, unless otherwise noted.
AMC1200-Q1
UNIT
Supply voltage, VDD1 to GND1 or VDD2 to GND2
–0.5 to 6
V
Analog input voltage at VINP, VINN
GND1 – 0.5 to VDD1 + 0.5
V
Input current to any pin except supply pins
±10
mA
Maximum junction temperature, TJ Max
150
°C
Human-body model (HBM) AEC-Q100 Classification
2.5
kV
Level H2
Electrostatic rating
Charged-device model (CDM) AEC-Q100
1000
V
Classification Level C3B
(1)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated is not implied. Exposure to absolute-
maximum-rated conditions for extended periods may affect device reliability.
THERMAL INFORMATION
AMC1200-Q1
THERMAL METRIC(1)
DUB (SOP)
UNIT
8 PINS
θJA
Junction-to-ambient thermal resistance
75.1
°C/W
θJCtop
Junction-to-case (top) thermal resistance
61.6
°C/W
θJB
Junction-to-board thermal resistance
39.8
°C/W
ψJT
Junction-to-top characterization parameter
27.2
°C/W
ψJB
Junction-to-board characterization parameter
39.4
°C/W
θJCbot
Junction-to-case (bottom) thermal resistance
N/A
°C/W
(1)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
REGULATORY INFORMATION
VDE/IEC
UL
Certified according to IEC 60747-5-2
Recognized under 1577 component recognition program
File number: 40016131
File number: E181974
Copyright © 2012, Texas Instruments Incorporated
Submit Documentation Feedback
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Product Folder Links: AMC1200-Q1


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