AD9740

Rev. B | Page 7 of 32

ABSOLUTE MAXIMUM RATINGS

Table 4.

Parameter

With

Respect to

Min

Max

Unit

AVDD

ACOM

−0.3

+3.9

V

DVDD

DCOM

−0.3

+3.9

V

CLKVDD

CLKCOM

−0.3

+3.9

V

ACOM

DCOM

−0.3

+0.3

V

ACOM

CLKCOM

−0.3

+0.3

V

DCOM

CLKCOM

−0.3

+0.3

V

AVDD

DVDD

−3.9

+3.9

V

AVDD

CLKVDD

−3.9

+3.9

V

DVDD

CLKVDD

−3.9

+3.9

V

CLOCK, SLEEP

DCOM

−0.3

DVDD + 0.3

V

Digital Inputs, MODE

DCOM

−0.3

DVDD + 0.3

V

IOUTA, IOUTB

ACOM

−1.0

AVDD + 0.3

V

REFIO, REFLO, FS ADJ

ACOM

−0.3

AVDD + 0.3

V

CLK+, CLK−, MODE

CLKCOM

−0.3

CLKVDD + 0.3

V

Junction

Temperature

150

°C

Storage

Temperature

Range

−65

+150

°C

Lead Temperature

(10 sec)

300

°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

sections of this specification is not implied. Exposure to

absolute maximum ratings for extended periods may effect

device reliability.

THERMAL CHARACTERISTICS1

Thermal Resistance

28-Lead 300-Mil SOIC

28-Lead TSSOP

32-Lead LFCSP

in accordance with EIA/JESD51-7.

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.