IRF6644PbF

www.irf.com

3

Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient



1E-006

1E-005

0.0001

0.001

0.01

0.1

1

10

100

t1 , Rectangular Pulse Duration (sec)

0.0001

0.001

0.01

0.1

1

10

100

0.20

0.10

D = 0.50

0.02

0.01

0.05

SINGLE PULSE

( THERMAL RESPONSE )

Notes:

1. Duty Factor D = t1/t2

2. Peak Tj = P dm x Zthja + Tc

τ

J

τ

J

τ

1

τ

1

τ

2

τ

2

τ

3

τ

3

R

1

R

1

R

2

R

2

R

3

R

3

Ci

i

/Ri

Ci=

τi/Ri

τ

τ

C

τ

4

τ

4

R

4

R

4

Ri (°C/W)

τi (sec)

0.6784

0.00086

17.299

0.57756

17.566

8.94

9.4701

106

Absolute Maximum Ratings

Parameter

Units

Power Dissipation

c

W

Power Dissipation

c

Power Dissipation

f

Peak Soldering Temperature

°C

Operating Junction and

Storage Temperature Range

Thermal Resistance

Parameter

Typ.

Max.

Units

Junction-to-Ambient

cg

–––

45

Junction-to-Ambient

dg

12.5

–––

Junction-to-Ambient

eg

20

–––

°C/W

Junction-to-Case

fg

–––

1.4

Junction-to-PCB Mounted

1.0

–––

270

-40 to + 150

Max.

89

2.8

1.8

Notes:

back and with small clip heatsink.

ƒ Surface mounted on 1 in. square Cu

board (still air).

‰ Mounted to a PCB with

small clip heatsink (still air)

‰ Mounted on minimum

footprint full size board with

metalized back and with small

clip heatsink (still air)