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Si7013-A10-GM1 Datenblatt(PDF) 5 Page - Silicon Laboratories

Teilenummer Si7013-A10-GM1
Bauteilbeschribung  I2C HUMIDITY AND TWO-ZONE TEMPERATURE SENSOR
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Hersteller  SILABS [Silicon Laboratories]
Direct Link  http://www.silabs.com
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Si7013-A10-GM1 Datenblatt(HTML) 5 Page - Silicon Laboratories

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Si7013
Rev. 0.95
5
Conversion Time1
tCONV
RH or Voltage Normal
5.8
7
ms
RH or Voltage Fast
2.6
3.1
ms
Temp Normal
4
4.8
ms
Temp Fast
1.5
1.8
ms
Powerup Time
tPU
From VDD ≥ 1.9 V to ready for a
conversion, 25 °C
—18
25
ms
From VDD ≥ 1.9 V to ready for a
conversion, full temperature range
——
80
ms
Table 3. I2C Interface Specifications1
1.9
 VDD  3.6 V; TA = –40 to +85 °C (G grade) or –40 to +125 °C (I/Y grade) unless otherwise noted.
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Hysteresis
VHYS
High-to-low versus low-to-
high transition
0.05 x VDD
——
V
SCLK Frequency2
fSCL
400
kHz
SCL High Time
tSKH
0.6
µs
SCL Low Time
tSKL
1.3
µs
Start Hold Time
tSTH
0.6
µs
Start Setup Time
tSTS
0.6
µs
Stop Setup Time
tSPS
0.6
µs
Bus Free Time
tBUF
Between Stop and Start
1.3
µs
SDA Setup Time
tDS
100
ns
SDA Hold Time
tDH
100
ns
Notes:
1.
All values are referenced to VIL and/or VIH.
2.
Depending on the conversion command, the Si7013 may hold the master during the conversion (clock stretch). At
above 300 kHz SCL, the Si7013 may hold the master briefly for user register and device ID transactions. At the highest
I2C speed of 400 kHz the stretching will be <10 µs.
3.
Pulses up to and including 50ns will be suppressed.
Table 2. General Specifications (Continued)
1.9 < VDD < 3.6 V; TA = –40 to 85 °C (G grade) or –40 to 125 °C (I/Y grade); default conversion time unless otherwise noted.
Parameter
Symbol
Test Condition
Min
Typ
Max
Unit
Notes:
1.
Initiating a RH measurement will also automatically initiate a temperature measurement. The total conversion time will
be tCONV(RH) + tCONV(T).
2.
No conversion or I2C transaction in progress. Typical values measured at 25 °C.
3.
Occurs once during powerup. Duration is <5 msec.
4.
Occurs during I2C commands for Reset, Read/Write User Registers, Read EID, Read Firmware Version, Read/Write
Thermistor Coefficients and Read Thermistor. Duration is <50 μs for all commands except Read Thermistor, which has
<150 μs duration.
5.
Additional current consumption when HTRE bit enabled. See Section “5.6. Heater” for more information.


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