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ADV7189BBSTZ268H2 Datenblatt(PDF) 9 Page - Analog Devices |
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ADV7189BBSTZ268H2 Datenblatt(HTML) 9 Page - Analog Devices |
9 / 104 page ADV7189B Rev. B | Page 9 of 104 THERMAL SPECIFICATIONS Table 5. Parameter 6F 1, 7F 2 Symbol Test Conditions Min Typ Max Unit THERMAL CHARACTERISTICS Junction-to-Case Thermal Resistance θJC 4-layer PCB with solid ground plane 7.6 °C/W Junction-to-Ambient Thermal Resistance (Still Air) θJA 4-layer PCB with solid ground plane 38.1 °C/W 1 Temperature range: TMIN to TMAX, –40°C to +85°C. (0°C to 70°C for ADV7189BKSTZ) 2 The min/max specifications are guaranteed over this range. TIMING DIAGRAMS SDA SCLK t3 t5 t3 t4 t8 t6 t7 t2 t1 Figure 2. I2C Timing OUTPUT LLC 1 OUTPUT LLC 2 OUTPUTS P0–P19, VS, HS, FIELD, SFL t9 t11 t10 t14 t13 t12 Figure 3. Pixel Port and Control Output Timing OE P0–P19, HS, VS, FIELD, SFL t15 t16 t17 Figure 4. OE Timing |
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Ähnliche Beschreibung - ADV7189BBSTZ268H2 |
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