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BCP68T Datenblatt(PDF) 4 Page - NXP Semiconductors |
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BCP68T Datenblatt(HTML) 4 Page - NXP Semiconductors |
4 / 12 page 2003 Nov 25 4 NXP Semiconductors Product data sheet NPN medium power transistor; 20 V, 1 A BCP68 handbook, halfpage Ptot (W) −60 60 0 120 180 Tamb (°C) 0 1.6 1.2 0.4 0.8 MDB846 (1) (2) (3) Fig.1 Power derating curve. (1) 6 cm2 collector mounting pad. (2) 1 cm2 collector mounting pad. (3) Standard PCB footprint. THERMAL CHARACTERISTICS Notes 1. See SOT223 (SC-73) standard mounting conditions. 2. Device mounted on a FR4 printed-circuit board; single-sided copper; tinplated; standard footprint for SOT223. 3. Device mounted on a FR4 printed-circuit board; single-sided copper; tinplated; 1 cm2 collector mounting pad. 4. Device mounted on a FR4 printed-circuit board; single-sided copper; tinplated; 6 cm2 collector mounting pad. SYMBOL PARAMETER CONDITIONS VALUE UNIT Rth(j-a) thermal resistance from junction to ambient Tamb ≤ 25 °C; notes 1 and 3 200 K/W Tamb ≤ 25 °C; notes 1 and 4 125 K/W Tamb ≤ 25 °C; notes 1 and 4 89 K/W Rth(j-s) thermal resistance from junction to solder point Tamb ≤ 25 °C 15 K/W |
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