New Product

SMA6F5.0A thru SMA6F20A

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Vishay General Semiconductor

Revision: 23-Nov-11

4

Document Number: 89458

THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

Fig. 5 - Power Dissipation Derating Curve

Fig. 6 - Typical Transient Thermal Impedance

PACKAGE OUTLINE DIMENSIONS in inches (millimeters)

0

1

2

3

4

5

6

7

0

25

50

75

100

125

150

175

200

T

FR-4 Board, on Minimum

Recommended Pad Layout

heatsink

1

10

100

1000

0.01

0.1

1

10

100

1000

t

DO-221AC (SlimSMA)

Cathode Band

0.106 (2.70)

0.098 (2.50)

0.047 (1.20)

0.030 (0.75)

0.047 (1.20)

MIN.

0.047 (1.20)

MIN.

0.123 (3.12) MAX.

0.217 (5.52) REF.

0.060 (1.52)

MIN.

0.057 (1.45)

0.049 (1.25)

0.039 (1.00)

0.035 (0.90)

0.012 (0.30)

0.006 (0.15)

0.171 (4.35)

0.163 (4.15)

0.211 (5.35)

0.199 (5.05)

Typ.: 0.019 (0.48)

Mounting Pad Layout